Cu core ball, solder paste, formed solder, cu core column, and solder joint

Abstract

Provided are a Cu core ball and a Cu core column making it possible to obtain drop strength and strength in relation to heat cycle. The Cu core ball (1) is provided with: a Cu ball (2) configured from Cu or a Cu alloy; and a solder layer (3) configured from a solder alloy comprising Sn and Cu, the solder layer (3) covering the Cu ball (2). The solder layer (3) contains 0.1-3.0% Cu, the balance being Sn and unavoidable impurities.

Description

Technical field [0001] The present invention relates to Cu core balls formed by covering Cu balls with a solder alloy, solder paste using Cu core balls, formed solder using Cu core balls, brazing joints using Cu core balls, Cu core columns (column) and Brazing joints using Cu core posts. Background technique [0002] In recent years, due to the development of small information equipment, electronic components mounted there are rapidly miniaturizing. In accordance with the requirements for miniaturization of electronic components, in order to cope with the narrowing of connection terminals and the reduction of mounting area, a ball grid array package (hereinafter referred to as "BGA") with electrodes provided on the back surface is being applied. [0003] Among the electronic components using BGA, there is, for example, a semiconductor package. In the semiconductor package, a semiconductor chip having electrodes is sealed with resin. Solder bumps are formed on the electrodes of t...

AI Technical Summary

Problems solved by technology

[0004] However, when BGA is applied to a semiconductor package mounted in three-dimensional high density, the solder balls are crushed due to the weight of the semiconductor package, and a connection short circuit occurs between electrodes.

This becomes an obstacle to high-density installation

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