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N-type dynamic threshold transistor, production method, and method of improving working voltage

A dynamic threshold, transistor technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems that transistors cannot share power supply voltage, limit application fields, low operating voltage, etc., to reduce threshold voltage and expand application value. , Improve the effect of driving current

Active Publication Date: 2016-08-24
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above-mentioned shortcoming of the prior art, the object of the present invention is to provide a kind of N-type dynamic threshold transistor, preparation method and the method for improving working voltage, be used for solving the low working voltage of SOI dynamic threshold transistor in the prior art, can not Shared power supply voltage with traditional transistors, limiting application areas and other issues

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  • N-type dynamic threshold transistor, production method, and method of improving working voltage
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  • N-type dynamic threshold transistor, production method, and method of improving working voltage

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Embodiment 1

[0060] Such as Figure 1 ~ Figure 2 As shown, the present invention provides an N-type dynamic threshold transistor 1, the N-type dynamic threshold transistor 1 at least includes: a substrate structure 11, n threshold adjustable structures located on the substrate structure 11, wherein, n is a natural number greater than or equal to 1. The N-type dynamic threshold transistor 1 of this embodiment only includes one threshold adjustable structure, and the following only introduces the N-type dynamic threshold transistor with one threshold adjustable structure.

[0061] Such as figure 2 As shown, the substrate structure 11 is located at the bottom layer and serves as a substrate for preparing semiconductor devices. Specifically, such as figure 2 As shown, in this embodiment, the substrate structure 11 at least includes a semiconductor base 111 and an oxide layer 112 on the semiconductor base 111 . The semiconductor substrate 111 includes but not limited to silicon, silicon d...

Embodiment 2

[0065] Such as image 3 As shown, in this embodiment, an N-type dynamic threshold transistor with a multi-finger structure is provided to meet the gain and power requirements of the radio frequency transistor.

[0066] Specifically, the N-type dynamic threshold transistor with a multi-finger structure includes n adjustable threshold structures, where n is a natural number greater than or equal to 1. In this embodiment, the value of n is 2. In actual design, the specific value of n is determined according to the requirements of gain and power, and is not limited to this embodiment. The structures and connections of the two NMOS transistors and the two diodes included in each threshold adjustable structure are consistent with those in Embodiment 1, and will not be repeated here.

Embodiment 3

[0068] Such as figure 1 with figure 2 As shown, the present invention also provides a preparation method of an N-type dynamic threshold transistor, and the preparation method of the N-type dynamic threshold transistor at least includes:

[0069] A substrate structure 11 is provided, and n threshold adjustable structures are formed on the substrate structure 11 as required, wherein n is a natural number greater than or equal to 1. As for the value of n, in actual design, it is determined by the requirements of gain and power.

[0070] The preparation method of the threshold adjustable structure at least includes:

[0071] First, a P-type intrinsic region is prepared on the substrate structure 11 . Specifically, such as figure 2 As shown, in this embodiment, the substrate structure 11 includes a semiconductor base 111 and an oxide layer 112 on the semiconductor base 111 . The substrate structure 11 may also include other semiconductor layers to improve device performance,...

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Abstract

The invention provides an N-type dynamic threshold transistor, a production method, and a method of improving working voltage. The N-type dynamic threshold transistor at least comprises a substrate structure and n threshold adjustable structures disposed on the substrate structure. Every threshold adjustable structure at least comprises two NMOS pipes and two diodes, and the two NMOS pipes share a body region, which is an N-type heavily doped region; the two diodes share the N region, and the body region shared by the two NMOS pipes can be used as the N region; the N region of the first diode is connected with the gate of the first NMOS pipe, and the N region of the second diode is connected with the gate of the second NMOS pipe. The reverse bias PN junction can be formed on the gate connection circuit of every NMOS pipe, and then the body contact region voltage can be improved, the threshold voltage can be reduced, the driving current can be improved, the working voltage can be improved, and the application value of the N-type dynamic threshold transistor in the low power consumption circuit design field can be expanded.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to an N-type dynamic threshold transistor, a preparation method and a method for increasing working voltage. Background technique [0002] As the entire semiconductor industry transitions to a new generation of semiconductor devices, chipmakers face serious challenges. Specifically, manufacturers of high-performance chips are challenged by the need for faster, cooler chip designs. Manufacturers of chips for mobile applications need semiconductor devices that consume less power. In order to meet these challenges, most of the industry's leading device manufacturers have chosen a silicon-on-insulator (SOI, Silicon OnInsulator) technology that has the advantages of low power consumption and high speed. [0003] With the continuous development of semiconductor technology, MOSFET (Metallic Oxide Semiconductor Field Effect Transistor, Metal Oxide Semiconductor Field Effect ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L21/336
Inventor 陈静吕凯罗杰馨柴展何伟伟黄建强王曦
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI