A kind of circlip dipping and leveling processing method and circlip
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A processing method and circlip technology, which is applied in the direction of connecting components, coatings, pre-treated surfaces, etc., can solve the problems of plastic layer falling off and the inability to guarantee the bonding strength of the plastic layer on the outer layer of the circlip wire, and achieve uniform heating , save the space of the production site, and improve the effect of bonding strength
Active Publication Date: 2019-02-01
北京丰隆科技有限公司
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Problems solved by technology
When the thickness of the plastic layer is thin, the adhesive strength of the plastic layer on the outer layer of the circlip wire can be guaranteed. When the thickness of the plastic layer is thicker, the adhesive strength of the plastic layer on the outer layer of the circlip wire cannot be guaranteed. , prone to partial plastic layer peeling off
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Embodiment 1
[0038] like figure 1 Shown is one of the embodiments of the present invention, in this embodiment, a method for dipping and leveling the circlip, the method includes the following steps:
[0039] Step 1) Pretreatment before dipping the circlip.
[0040] Step 2) Reserve a section of metal body at both ends of the circlip to clamp the conductive pliers, and energize and heat the circlip; in this step, if the circlip is regarded as a resistance wire, because the reserved section does not constitute a part of the circuit, it is reserved The temperature of the section does not change significantly, and the temperature of other parts of the circlip is not as high.
[0041] Step 3) After detaching from the conductive clamp, dip the circlip in plastic, so that the heated part outside the reserved section is coated with plastic powder. In this step, the circlip can be soaked in the plastic powder pool, or it can be sprayed with powder. Because the temperature of the reserved section ...
Embodiment 2
[0057] like figure 2 , image 3 Shown is the second embodiment of the present invention. In this embodiment, step 6) and step 7) in embodiment 1 can be repeated to perform dipping and leveling on the reserved sections at both ends of the circlip several times. Specifically, it can be repeated 1 time, 2 times, or 3 times, etc.
[0058] Through repeated dipping and leveling, the diameter of the reserved section at both ends of the circlip is larger than the diameter of other parts of the circlip, and the thickened layer is composed of a plastic layer. like image 3 As shown in , the thickened segment 1-2 has a larger diameter than the base segment 1-1.
[0059] Thickening the two ends of the circlip can better prevent the circlip from piercing the greenhouse film during use.
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Abstract
The invention discloses a plastic coating leveling processing method for a clamp spring. The method includes the following steps that firstly, preprocessing is performed before plastic coating of the clamp spring; secondly, a segment of metal body is reserved at each of the two ends of the clamp spring for clamping conductive pliers, and the clamp spring is powered on to be heated; thirdly, after disengaging from the conductive pliers, the clamp spring is subjected to plastic coating, and heated portions except the reserved segments are coated with plastic powder; fourthly, the conductive pliers are clamped on the reserved segments, subjected to plastic coating, of the two ends of the clamp spring again, the clamp spring is powered on to be heated, and the plastic powder is subjected to plastifying leveling; fifthly, after the clamp spring disengages from the conductive pliers, the reserved segments at the two ends of the clamp spring are heated through high-temperature airflow; sixthly, the reserved segments at the two ends of the clamp spring are subjected to plastic coating, and the reserved segments are made to be coated with plastic powder; seventhly, the plastic coated portions of the reserved segments at the two ends of the clamp spring are heated through high-temperature airflow, and the plastic powder is subjected to plastifying leveling; and eighthly, the clamp spring is cooled, and a finished product is obtained. The plastic coating leveling processing method has the beneficial effects that the process is simple and easy to operate, the processing speed is high, heating is uniform, and bonding of a plastic layer is firm.
Description
technical field [0001] The invention relates to a plastic dipping and leveling processing method for a circlip, in particular to a processing method for energizing a circlip and dipping and leveling it. The invention also relates to a clip spring. Background technique [0002] In the solid film structure of the plastic film greenhouse, a circlip is required, and the surface of the circlip is provided with a plastic layer, which is made by a dipping process. The circlip dipping process in the prior art usually uses high-temperature airflow to heat the circlip, or uses a high-temperature environment to heat the circlip in an oven to complete operations such as pre-baking and plasticizing flow. [0003] For example, as shown in the Chinese invention patent "Secondary Leveling Process of Spring Dip Plastic" (authorized publication number: CN102114465B), from the attached figure 1 And attached figure 2 It can be seen that the invention utilizes a high-temperature environment ...
Claims
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Application Information
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