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Epoxy resin composition suitable for being adopted at low temperature and preparation method thereof

A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition for ultra-low temperature and its preparation, can solve the problems that resin is difficult to completely infiltrate fiber, difficult to obtain uniform adhesive film, resin accumulation and poor adhesive, etc. The effect of micro-cracking ability, mild reaction exotherm, and high cross-linking density

Active Publication Date: 2016-08-31
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the resin viscosity is too low, it is easy to form resin accumulation and poor glue, and it is difficult to obtain a uniform film; if the viscosity is too high, a higher impregnation temperature is required, not only it is difficult for the resin to completely penetrate the fiber, but also there is a risk of violent polymerization

Method used

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  • Epoxy resin composition suitable for being adopted at low temperature and preparation method thereof
  • Epoxy resin composition suitable for being adopted at low temperature and preparation method thereof
  • Epoxy resin composition suitable for being adopted at low temperature and preparation method thereof

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Effect test

preparation example Construction

[0050] The preparation method of the epoxy resin composition that the present invention is suitable for low temperature use comprises the steps:

[0051] (1) Mix multifunctional epoxy resin and bisphenol A polyether epoxy resin evenly, add thermoplastic resin at a temperature of 120°C to 130°C, stir and dissolve to obtain a transparent and uniform hot-melt mixture;

[0052] (2) Cool the hot-melt mixture to 80°C-100°C, mix it with curing agent and interface modifier evenly in a high-speed stirring disperser, the stirring speed is 1000-3000r / min, and after thorough mixing, it is suitable for low-temperature environment The epoxy resin composition used.

[0053] In the epoxy resin composition prepared by the above method, the D component, that is, the solid curing agent is fully and uniformly dispersed rather than being dissolved in the epoxy resin, so the composition has a long shelf life at room temperature, and for the composition Viscosity control is very beneficial. In add...

Embodiment 1

[0055] The components and proportioning of the epoxy resin composition are listed in Table 1:

[0056] Table 1

[0057]

[0058] The preparation method of epoxy resin composition is as follows:

[0059] According to the ratio shown in Table 1, mix m-aminophenol triglycidyl epoxy resin and bisphenol A polyether epoxy resin evenly, add polyethersulfone at 120°C, stir and dissolve; then cool down to 80°C, Add 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone and core-shell structure polymer P52, and mix evenly in a high-speed stirring disperser at a stirring speed of 2000r / min to obtain epoxy resin composition. Such as figure 2 Shown is the microscopic morphology of the fractured resin cast body in Example 1 of the present invention. It can be seen from the figure that the P52 core-shell polymer exists in the form of dispersed particles, and is torn into an anchor-like microscopic morphology when fractured.

[0060] Performance Testing:

[0061] (1), the mechanica...

Embodiment 2

[0074] Components and proportioning of epoxy resin composition are listed in table 3:

[0075] table 3

[0076]

[0077] The preparation method of epoxy resin composition is as follows:

[0078] Mix m-aminophenol triglycidyl epoxy resin and bisphenol A polyether epoxy resin evenly according to the ratio shown in Table 3, add polyethersulfone at 130°C, stir and dissolve; then cool down to 90°C, Add 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone and core-shell structure polymer P52, and mix evenly in a high-speed stirring disperser at a stirring speed of 1500r / min to obtain epoxy resin composition.

[0079] Performance Testing:

[0080] (1), the mechanical properties of the cured product of the low temperature epoxy resin composition in this embodiment are as follows:

[0081] The impact strength is 28.5±3.2KJ / m 2 (liquid nitrogen temperature); elongation at break 2.7% (liquid nitrogen temperature);

[0082] (2) The cured resin / casting body did not produce mic...

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Abstract

The invention relates to an epoxy resin composition suitable for being adopted at low temperature. The composition comprises a polyfunctionality epoxy resin, biphenol A polyether epoxy resin, thermoplastic resin, a curing agent and an interfacial modification agent, wherein the composition is prepared from, by mass, 100 parts of polyfunctionality epoxy resin and biphenol A polyether epoxy resin, 20-40 parts of thermoplastic resin, 30-50 parts of the curing agent and 2-5 parts of the interfacial modification agent. The epoxy resin composition has the good manufacturability, the cured product has the advantage of being not likely to crack at low temperature, and the prepared carbon fiber composite material has the advantages of improving micro-crack resistance, being good in interface bonding force and the like, and is suitable for the fields of aircraft structural component manufacutirng, fuel storage tank and other military low temperature wind tunnels.

Description

technical field [0001] The invention relates to an epoxy resin composition suitable for low temperature use and a preparation method thereof, in particular to an epoxy resin composition for ultra-low temperature suitable for preparing carbon fiber reinforced composite material prepregs by a hot-melt method and a preparation method thereof. Background technique [0002] With the increasing demand for large-scale cryogenic projects, especially the construction of reusable vehicles and superconducting Tokamak, new requirements are put forward for the development of various high-performance advanced materials and the improvement of manufacturing technology. In recent years, lightweight and high-strength polymer-based composites with low-temperature resistance have received extensive attention internationally. Due to the excellent mechanical, electrical insulation and chemical corrosion resistance of epoxy resin, it is mainly used as the matrix of fiber reinforced composite mater...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L81/06C08L71/10C08G59/38C08G59/24C08G59/50
CPCC08G59/245C08G59/3227C08G59/38C08G59/504C08L63/00C08L2205/03C08L2207/53C08L81/06C08L71/00
Inventor 尚呈元孙宝岗凌辉王俊峰史汉桥林松郑红飞
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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