A kind of epoxy resin composition suitable for low temperature use and preparation method thereof
A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition for ultra-low temperature and its preparation, which can solve the problems that the resin is difficult to completely penetrate the fiber, it is difficult to obtain a uniform film, resin accumulation and poor glue, etc., to achieve excellent resistance The effect of micro-crack ability, gentle reaction exotherm, and high cross-linking density
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[0050] The preparation method of the epoxy resin composition that the present invention is suitable for low temperature use comprises the steps:
[0051] (1) Mix multifunctional epoxy resin and bisphenol A polyether epoxy resin evenly, add thermoplastic resin at a temperature of 120°C to 130°C, stir and dissolve to obtain a transparent and uniform hot-melt mixture;
[0052] (2) Cool the hot-melt mixture to 80°C-100°C, mix it with curing agent and interface modifier evenly in a high-speed stirring disperser, the stirring speed is 1000-3000r / min, and after thorough mixing, it is suitable for low-temperature environment The epoxy resin composition used.
[0053] In the epoxy resin composition prepared by the above method, the D component, that is, the solid curing agent is fully and uniformly dispersed rather than being dissolved in the epoxy resin, so the composition has a long shelf life at room temperature, and for the composition Viscosity control is very beneficial. In add...
Embodiment 1
[0055] The components and proportioning of the epoxy resin composition are listed in Table 1:
[0056] Table 1
[0057]
[0058] The preparation method of epoxy resin composition is as follows:
[0059] According to the ratio shown in Table 1, mix m-aminophenol triglycidyl epoxy resin and bisphenol A polyether epoxy resin evenly, add polyethersulfone at 120°C, stir and dissolve; then cool down to 80°C, Add 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone and core-shell structure polymer P52, and mix evenly in a high-speed stirring disperser at a stirring speed of 2000r / min to obtain epoxy resin composition. Such as figure 2 Shown is the microscopic morphology of the fractured resin cast body in Example 1 of the present invention. It can be seen from the figure that the P52 core-shell polymer exists in the form of dispersed particles, and is torn into an anchor-like microscopic morphology when fractured.
[0060] Performance Testing:
[0061] (1), the mechanica...
Embodiment 2
[0074] Components and proportioning of epoxy resin composition are listed in table 3:
[0075] table 3
[0076]
[0077] The preparation method of epoxy resin composition is as follows:
[0078] Mix m-aminophenol triglycidyl epoxy resin and bisphenol A polyether epoxy resin evenly according to the ratio shown in Table 3, add polyethersulfone at 130°C, stir and dissolve; then cool down to 90°C, Add 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone and core-shell structure polymer P52, and mix evenly in a high-speed stirring disperser at a stirring speed of 1500r / min to obtain epoxy resin composition.
[0079] Performance Testing:
[0080] (1), the mechanical properties of the cured product of the low temperature epoxy resin composition in this embodiment are as follows:
[0081] The impact strength is 28.5±3.2KJ / m 2 (liquid nitrogen temperature); elongation at break 2.7% (liquid nitrogen temperature);
[0082] (2) The cured resin / casting body did not produce mic...
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