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High-temperature resistant single-component epoxy structure glue, preparation method and using method thereof

An epoxy structural adhesive, one-component technology, applied in the direction of epoxy resin adhesive, non-polymer adhesive additive, novolac epoxy resin adhesive, etc., can solve the problem of bonding epoxy adhesive to non-metal Surface overheating, small thermal expansion coefficient, affecting product quality, etc., to achieve the effect of adjustable viscosity range, high viscosity, and elimination of interfacial stress

Inactive Publication Date: 2010-12-29
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention aims at the poor thermal conductivity of ordinary epoxy resin, which easily causes overheating of the epoxy adhesive and non-metal bonding surface, thereby generating internal stress and affecting product quality, and provides a high temperature resistant single-component epoxy structural adhesive and its The preparation method and the use method, the high temperature resistant one-component epoxy structural adhesive has both certain metal characteristics and non-metal characteristics, which can not only play the role of bonding, but also play the role of filling gaps. The small coefficient of thermal expansion enables the cured product to be used at a higher temperature for a long time without cracking due to internal stress

Method used

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  • High-temperature resistant single-component epoxy structure glue, preparation method and using method thereof

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Experimental program
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Effect test

Embodiment 1

[0019] Calculated by the total weight of epoxy resin in units of 100

[0020] Epoxy resin E-51 50g, F-51 50g and toughening agent KH-07A 2.5g, KH-07B 2.5g, KH-07C 2.5g, KH-07D 2.5g, γ-aminopropyl triethoxy Add 1g of silane into the mixing kettle, stir for 1h~2h at room temperature, and rotate at 100r~180rpm; add 5g of alumina powder, 10g of spherical aluminum powder, 5g of silicon micropowder, stir at 1000r~1200rpm for 20min~40min, mix well and then reduce to At room temperature, add 3g of dicyandiamide, 2g of toluene-2,4-di[N,N-dimethylamino]propionurea, stir at 100r~180rpm for 30min, finally add 3g of fumed silicon, stir for 20min~40min, adjust the viscosity to 200~ 400Pa·s, the epoxy structural adhesive is obtained from the discharge.

[0021]

Embodiment 2

[0032] Calculated by the total weight of epoxy resin in units of 100

[0033] Add 70g of epoxy resin E-51, 30g of F-51, 5g of toughening agent KH-07C, 20g of KH-07D, 5g of γ-aminopropyltriethoxysilane into the mixing tank, stir at room temperature for 1h~2h, and rotate at 100r~180rpm; add 10g of alumina powder, 20g of spherical aluminum powder, 10g of silicon micropowder, stir at 1000r~1200rpm for 20min~40min, mix well and lower to room temperature, add 6g of dicyandiamide, toluene-2,4- 4g of di[N,N-dimethylamino]propaneurea, stirred at 100r~180rpm for 30min, finally added 8g of fumed silicon and stirred for 20min~40min, adjusted the viscosity to 200~400Pa·s and discharged to obtain epoxy structural adhesive.

[0034]

Embodiment 3

[0047] Calculated by the total weight of epoxy resin in units of 100

[0048] Add 20g of epoxy resin E-51, 80g of F-51, 18g of toughening agent KH-07C, 3g of silane coupling agent γ-aminopropyltriethoxysilane into the mixing kettle, stir at room temperature for 1 h~2h, and rotate at 100r~180rpm; add 5g of alumina powder, 15g of spherical aluminum powder, 10g of silicon micropowder, stir at 1000r~1200rpm for 20min~40min, mix well and cool down to room temperature, add 6g of dicyandiamide, toluene-2,4- Di[N,N-dimethylamino]propaneurea 1g, stirred at 100r~180rpm for 30min, finally added 5g of fumed silicon and stirred for 20min~40min, adjusted the viscosity to 200~400Pa·s and discharged to obtain epoxy structural adhesive.

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Abstract

The invention relates to a high-temperature resistant single-component epoxy structure glue, a preparation method and a using method thereof. The epoxy structure glue is prepared by raw materials based on parts by weight: 100 parts of epoxy resin, 10-25 parts of toughening agent, 20-40 parts of filler, 1-5 parts of coupling agent, 5-10 parts of curing agent and 3-8 parts of thixotropic agent. The high-temperature resistant single-component epoxy structure glue has certain properties in the aspects of metal and nonmetal, thus not only having the adhesive bonding function, but also being used for filling gaps; and due to the low coefficient of thermal expansion, the cured product can be used for a long time at higher temperature and does not crack by internal stress.

Description

technical field [0001] The invention relates to an epoxy structural adhesive and a preparation method and a use method thereof, in particular to a high-temperature-resistant single-component epoxy structural adhesive and a preparation method and a use method thereof, belonging to the field of adhesives. Background technique [0002] Epoxy resin adhesives have excellent bonding properties and are widely used in bonding occasions. In some adhesive applications, one side is metal such as aluminum, and the other side is non-metal such as phenolic resin. Metal has good thermal conductivity, while non-metal has poor thermal conductivity, and there is a large gap between metal and non-metal. Add epoxy structural glue for bonding. Ordinary epoxy resin has poor thermal conductivity, which can easily cause overheating of the epoxy adhesive and non-metal bonding surface, resulting in internal stress and affecting product quality. Contents of the invention [0003] The invention aim...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J11/04
Inventor 王红玉王建斌解海华
Owner YANTAI DARBOND TECH
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