Packaging film for electronic components

Abstract

The invention belongs to the field of electronic components and discloses a packaging film for the electronic components. The packaging film is prepared from ethylene-vinyl acetate copolymer, silane coupling agent, rosin resin, plant ash, illite, stearic acid, zeolite powder and fatty acid polyglycol ester. The packaging film is a thin film being 10-100micron in thickness or a coating being 30-100micron in thickness; by treatment at 200DEG C for one hour, the elongation of the packaging film is lower than 4.5% while the tensile strength of the packaging film is higher than 56MPa at 30DEG C, so that the packaging film is excellent in mechanical property and capable of strongly protecting the electronic components from physical and electron loss caused by external or other surrounding electronic components after packaging the electronic components; the vapor permeation rate is lower than 0.03g / m<2> / 24h, so that the packaging film has an excellent waterproof and damp-proof function and is capable of protecting the electronic components from water damage in storage, transport and utilization after packaging the electronic components, and oxidative corrosion of the electronic components can be greatly decelerated.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a packaging film for electronic components. Background technique [0002] Electronic components are an important part of electronic equipment or electromechanical equipment. There are many types of electronic components, and their volume is relatively small, and they are often scattered in electronic equipment. However, during use, electronic components are often deformed, oxidized or otherwise physically and chemically damaged by the environment (such as water, heat, etc.) and surrounding components, which affects the normal use of current equipment. [0003] In order to solve the above problems, rubber films are generally used for protection and fixing, such as Chinese patent application CN103773257A, which discloses a film for packaging electronic components. Although the film can solve the problem to a certain extent, the mechanical properties of the film The strength is...

AI Technical Summary

Problems solved by technology

However, due to the influence of the environment (such as water, heat, etc.) and surrounding components during use, electronic components are often deformed, oxidized or otherwise physically and chemically damaged, which affects the normal use of current equipment

[0003] In order to solve the above problems, rubber films are generally used for protection and fixing, such as Chinese patent application CN103773257A, which discloses a film for packaging electronic components. Although the film can solve the problem to a certain extent, the mechanical properties of the film The strength is still poor, and the water and moisture resistance is also poor. After a long time, it will cause oxidation and corrosion of electronic components