A detection method of the aluminum spray layer on the edge of the target

A detection method and target material technology, applied in metal material coating process, coating, analysis materials, etc., can solve the problem of inability to accurately and effectively monitor the quality of aluminum sputtering layer, light, personnel, angle uncertainty, coating Incomplete detection and other problems, to achieve the effect of objective detection method, intuitive detection structure and simple operation

Active Publication Date: 2018-08-24
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology

[0006] The present invention is aimed at the prior art, the traditional detection method of the fusion layer on the edge of the target can only control the quality of the aluminum fusion layer through visual inspection and detection of roughness, and visual inspection of the existing light, Due to the uncertainty of personnel and angles, it is impossible to accurately and effectively monitor the quality of the aluminum spray layer, and the roughness detection can only be carried out on the surface of the coating, and there are defects such as incomplete coating detection. Detection method of aluminum spray layer on material edge

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  • A detection method of the aluminum spray layer on the edge of the target
  • A detection method of the aluminum spray layer on the edge of the target
  • A detection method of the aluminum spray layer on the edge of the target

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Embodiment Construction

[0025] In order to illustrate the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0026] In the physical vapor deposition system, the target, as an important component, is widely used in the field of integrated circuit manufacturing. In order to prevent particle defects caused by the peeling of the reverse deposition film (Re-deposition Film) on the edge of the target during the process, it is usually necessary to spray an aluminum spray layer on the edge of the target to increase the roughness of the target, thereby increasing the reverse deposition film. Absorbency prevents peeling. However, when the quality of the aluminum sprayed layer on the edge of the target is abnormal, a discharge phenomenon will be formed, resulting in the peeling off of a large number of reverse deposited films and spherical arc defects.

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Abstract

The invention relates to a detection method for an aluminium metallizing layer at the edge of a target. The detection method comprises the following steps: step S1: arranging a to-be-sputtered target in a vacuum chamber, and setting preset distance between the transverse end face of the target and an isolating suite in the vacuum chamber; step S2: introducing argon and nitrogen into the vacuum chamber, and controlling pressure of the vacuum chamber at preset pressure via a pumping unit; step S3: applying voltage to the target via an external power source, with output power of P1, and monitoring direct-current power output value Pd; step S4: presetting stabilization time, ensuring that the direct-current power output value Pd meets the formula that Pd is more than or equal to a and smaller than or equal to b; step S5: continuously observing the direct-current power output value Pd with preset time, and when Pd equals to c, and b is less than c and more than or equal to a, judging that the quality of the aluminium metallizing layer at the edge of the target is abnormal. By adopting the detection method to carry out detection on the quality of the aluminium metallizing layer, the operation is simple, the use is convenient, the detection structure is relatively intuitive, and the detection method is objective and accurate and is worthy of popularization and application.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for detecting an aluminum sputtering layer at the edge of a target. Background technique [0002] In the physical vapor deposition system, the target, as an important component, is widely used in the field of integrated circuit manufacturing. In order to prevent particle defects caused by the peeling of the reverse deposition film (Re-deposition Film) on the edge of the target during the process, it is usually necessary to spray an aluminum spray layer on the edge of the target to increase the roughness of the target, thereby increasing the thickness of the reverse deposition film. Absorbent to prevent peeling. However, when the quality of the aluminum sprayed layer on the edge of the target is abnormal, a discharge phenomenon will be formed, resulting in the peeling off of a large number of reverse deposited films and spherical arc defects. [0003...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34G01N27/00
CPCC23C14/3407C23C14/3492G01N27/00
Inventor 胡彬彬王东
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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