A method of low-temperature fusion sealing between a device to be packaged and a glass insulating terminal and its application

A technology for encapsulating devices and glass insulation, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low air tightness, low efficiency, and high production costs, and improve the air tightness compliance rate and reliability. performance, reducing material cost

Active Publication Date: 2019-01-11
泰格尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of high production cost, low efficiency and low airtightness in the sealing process of the existing device to be packaged and the glass insulating terminal, and provides a method of low-temperature fusion sealing of the device to be packaged and the glass column and its application

Method used

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  • A method of low-temperature fusion sealing between a device to be packaged and a glass insulating terminal and its application
  • A method of low-temperature fusion sealing between a device to be packaged and a glass insulating terminal and its application

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specific Embodiment approach 1

[0014] Specific implementation mode 1: In this implementation mode, a method for low-temperature fusion sealing of a device to be packaged and a glass insulating terminal is specifically carried out according to the following steps:

[0015] A layer of low-melting glass powder is sintered on the outer surface of the high-temperature glass column of the glass insulating terminal to obtain a composite glass column; then the composite glass column is placed in the end hole of the device shell to be packaged, assembled with a jig and directly sintered and packaged, that is Complete the sealing of the device to be packaged and the glass column; the material of the device to be packaged is high-silicon aluminum, aluminum alloy or aluminum-based composite material.

specific Embodiment approach 2

[0016] Embodiment 2: This embodiment differs from Embodiment 1 in that: the dielectric constant of the high-temperature glass column of the glass insulating terminal is 4-4.5. Others are the same as the first embodiment.

specific Embodiment approach 3

[0017] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the melting point of the high-temperature glass column of the glass insulating terminal is 900°C-960°C. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a method for low-temperature melting sealing of a device to be packaged and a glass insulating terminal and application of the method. The method and the application of the method aim at solving the problems of high production cost, low efficiency and low air impermeability in the existing sealing-in process of a device to be packaged and a glass insulating terminal. According to the method, a non-matching sealing-in mode is adopted, in other words, low-melting-point glass powder is adopted as a transitional sealing-in melting solder material, and a kovar alloy ring is omitted; a layer of low-melting-point glass is sintered on the outer side of a high-temperature glass column of an insulating terminal to make a composite glass column, the composite glass column is installed in an end hole of the device to be packaged and assembled through a fixture, and then sintering packaging is directly carried out. The method and the application of the method are applied to packaging of phased-array radar T / R tube shells for aviation, aerospace, ships and warships and ground equipment, and sealing-in of metal shells and glass parts of precise components in other fields.

Description

technical field [0001] The invention relates to a low-temperature melting sealing method of a device to be packaged and a glass insulating terminal and an application thereof. Background technique [0002] With the rapid development of information technology, the integration and heat generation of high-power electronic components are getting higher and higher, and excessive temperature has become one of the important factors affecting the accuracy of devices and causing device failure. higher requirement. At the same time, electronic components tend to generate large thermal stress during thermal cycle operation. If the thermal expansion coefficient (Coefficient of thermal expansion, CTE) between the electronic packaging material and the semiconductor chip substrate does not match, it is easy to cause thermal fatigue failure of electronic components. For aerospace, it is desirable that electronic packaging materials have a lower density to reduce launch and flight costs whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C27/04H01L21/50
Inventor 牛济泰
Owner 泰格尔科技有限公司
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