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Device and method for measuring ultra-high temperature flexural modulus and fracture strain of materials

A technology of flexural elastic modulus and fracture strain, which is applied in measuring devices, using stable bending force to test the strength of materials, analyzing materials, etc. question

Active Publication Date: 2020-04-10
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The main reason is that under ultra-high temperature conditions, many tests above 1500 °C are mostly carried out in vacuum (inert gas) furnaces, without air cooling and other heat dissipation conditions, while extensometers work in vacuum (inert gas) furnaces, and the ultra-high temperature test environment The high temperature brought by radiation and heat conduction exceeds the maximum service temperature of existing strain gauge, inductive, and capacitive extensometers, so it is impossible to measure parameters such as flexural elastic modulus and fracture strain
[0004] Invention patent CN 105092372A discloses "a system and method for real-time monitoring of metal sample strain in high-temperature and high-pressure environments", but the above-mentioned method has the following shortcomings: First, the above-mentioned strain measurement method is suitable for metal tensile tests, but not Bend tests on brittle materials
Second, the above-mentioned strain measurement method leads the deformation of the sample out of the high-temperature furnace. There are many connection parts and the deformation loss is relatively large. For metal samples with large strains, the accuracy can still meet the requirements, but for ultra-high temperature service environments Ceramic-based, carbon / carbon, and ultra-high-temperature ceramic samples have high elastic modulus, low fracture strain, and high requirements for deformation measurement accuracy. The above-mentioned disclosed patents are not suitable for bending strain measurement of materials in ultra-high temperature environments

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  • Device and method for measuring ultra-high temperature flexural modulus and fracture strain of materials
  • Device and method for measuring ultra-high temperature flexural modulus and fracture strain of materials
  • Device and method for measuring ultra-high temperature flexural modulus and fracture strain of materials

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments:

[0033] A device for measuring the bending elastic modulus and breaking strain of materials at ultra-high temperature, such as figure 1 As shown, including load transfer structure, deformation transfer structure and deformation sensor 11,

[0034] The load transfer structure includes an upper indenter 3, a lower indenter 6, a hot-end lower indenter 7 and a water-cooling protective sleeve 8. The lower indenter 6 has a through hole in the center, and a bending specimen 4 is placed on the lower indenter 6, and The indenter 3 is located above the center of the bent specimen 4. The water-cooled protective sleeve 8 is a hollow water-cooled I-shaped structure, including upper and lower beams and a middle column, which is used to block the heat conducted by the lower pressure rod 7 at the hot end. The water-cooled protective sleeve 8 The center has a through ho...

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PUM

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Abstract

The invention discloses a device for measuring superhigh temperature flexure elasticity modulus and fracture strain of a material. The device comprises a load transmitting structure, a deformation transmitting structure and a deformation sensor. The problem that in the test environment with the temperature of 1500 DEG or above, temperature of the environment where a traditional deformation sensor is located exceeds service temperature, and measurement cannot be carried out through the traditional deformation sensor is solved. A water cooling protective sleeve is connected to a hot end pressing rod, heat conduction and heat radiation to the deformation sensor by the outside can be effectively blocked, which is beneficial for reducing the temperature of the deformation sensor, the temperature deformation sensor is made to be 50 DEG C or below, and then the deformation sensor can measure flexure elasticity modulus and fracture strain of the material in the superhigh temperature environment.

Description

Technical field [0001] The invention relates to a device and method for measuring the flexural modulus and fracture strain of materials at ultra-high temperature, and belongs to the field of material mechanical performance testing. Background technique [0002] With the rapid development of the field of hypersonic aircraft in the near space, the aircraft operates at hypersonic speed (> 5Ma) When flying in the atmosphere, the hot end parts such as the nose cone and the leading edge of the wing are subjected to severe aerodynamic heating. The temperature of the severe part can reach 1800℃ or more. High requirements are put forward for materials that can be used in this temperature range, which promotes carbon / Development of carbon, ceramic matrix composite materials, ultra-high temperature ceramic materials and refractory metal materials. Therefore, in the design of aircraft and the development of new materials, mechanical performance testing under ultra-high temperature condit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/20G01N3/02
CPCG01N3/02G01N3/20G01N2203/0023G01N2203/0067G01N2203/0075G01N2203/0226
Inventor 卢克非章妮李西颜张涛王晓薇
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH