Solder paste injection valve

A technology of spray valve and solder paste, applied in the direction of spray device, liquid spray device, etc., can solve the problems of non-contact spray of solder paste, low production cost, etc., to avoid screw stirring mechanism, low use cost, and prevent cold welding. Effect

Inactive Publication Date: 2016-11-09
SUZHOU SOLDER FORCE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a solder paste injection valve, which solves the problem that the solder paste cannot be sprayed in contact, expands the types of solder paste that can be sprayed, is easy to maintain, has a long service life, and is low in production cost

Method used

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Embodiment Construction

[0015] The applicant will describe in detail in the form of the following examples, but the description of the examples is not a limitation to the technical solution of the present invention, and any equivalent transformation made according to the concept of the present invention is only a formal rather than a substantive equivalent transformation All should be regarded as the scope of the technical solution of the present invention.

[0016] In the following descriptions, all concepts related to directionality or orientation of up, down, left, right, front and back are based on figure 1 The position shown is a reference, so it cannot be understood as a special limitation on the technical solution provided by the present invention.

[0017] see figure 1 and figure 2 , The present invention relates to a solder paste injection valve, comprising a valve body 1 , a striker 2 , a spring adjustment seat 3 , a driving spring 4 and an injection part 5 . The spring adjusting seat 3...

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Abstract

The invention discloses a solder paste injection valve, and belongs to the technical field of fluid control of automatic equipment. The solder paste injection valve comprises a valve body, a striker, a spring regulating base, a drive spring and an injection part, wherein the valve body comprises a piston cavity, a spring base cavity and a valve body shaft hole; a gas inlet is formed in the side wall, which corresponds to the lower portion of the piston cavity, of the valve body; a piston is formed in the middle of the height direction by the striker; the piston is accommodated in the piston cavity; an air runner which communicates with the gas inlet is formed by a gap, which corresponds to the lower portion of the piston, of the piston cavity; a spring cavity is formed at one end, towards the valve body, of the spring regulating base; the drive spring is arranged in the spring cavity and sleeves the striker; an injection part shaft hole for allowing the striker to insert is formed in the middle of the axial direction of the injection part; a solder paste runner is formed by a gap between the inner side wall of the injection part shaft hole and the striker; a feeding hole which communicates with the solder paste runner is formed in the side wall of the injection part; and a spray nozzle is arranged at the bottom end of the injection part. The solder paste injection valve can prevent a solder ball from cold welding due to contact extrusion, expands types of tin solder paste capable of being injected, is convenient to maintain, is long in service life, and is low in cost.

Description

technical field [0001] The invention belongs to the technical field of fluid control of automation equipment, and in particular relates to a solder paste injection valve. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT (Surface Mount Technology). It is an extremely important auxiliary material in the production of electronic products and is used for selective soldering in semiconductor packaging and PCBA (Assembled Printed Circuit Board). . The coating process of solder paste can be divided into two methods, one is screen printing, which is suitable for mass production, and the other is injection coating, that is, solder paste printing technology. The most obvious difference from screen printing technology is that jet printing technology is a non-stencil technology, which can spray solder paste at a very high speed through a unique injector. For the selective coating of space constraints and special-shaped components, Je...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B9/047
CPCB05B9/047
Inventor 许文斌叶炬贤
Owner SUZHOU SOLDER FORCE INC
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