Floor tile glue and preparation method thereof
A technology of floor tile and weight ratio, applied in the field of floor tile adhesive, can solve problems such as pungent smell and affect people's health, and achieve the effects of no formaldehyde release, excellent bonding strength and nail holding force, and good machinability.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0010] A floor tile adhesive comprises polytetramethylene glycol, modified polypropylene resin, acrylate, hydroxypropyl methylcellulose and n-butanol in a weight ratio of 5:4:6:1.2:1.6.
[0011] According to the weight ratio of polytetramethylene glycol, modified polypropylene resin, acrylate, hydroxypropyl methylcellulose and n-butanol, stir and mix at 60-80°C.
Embodiment 2
[0013] A floor tile adhesive comprising polytetramethylene glycol, modified polypropylene resin, acrylate, hydroxypropyl methylcellulose and n-butanol in a weight ratio of 4:5:4:2:1.
[0014] According to the weight ratio of polytetramethylene glycol, modified polypropylene resin, acrylate, hydroxypropyl methylcellulose and n-butanol, stir and mix at 60-80°C.
Embodiment 3
[0016] A floor tile adhesive, comprising polytetramethylene glycol, modified polypropylene resin, acrylate, hydroxypropyl methylcellulose and n-butanol in a weight ratio of 6:3:8:1:2.
[0017] According to the weight ratio of polytetramethylene glycol, modified polypropylene resin, acrylate, hydroxypropyl methylcellulose and n-butanol, stir and mix at 60-80°C.
[0018] The characteristic of above-mentioned embodiment product:
[0019] 1. Moderate viscosity, easy to use.
[0020] 2. Fast curing and high bonding strength.
[0021] 3. It is superior to the traditional particleboard glue process.
[0022] 4. After curing, it has excellent bonding strength, aging resistance, oil and fat resistance.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More