A small liquid cooling system and method driven by an electro-hydraulic power micropump

Abstract

The invention discloses a small liquid cooling system driven by electro-hydraulic micropumps and a method. The system comprises a liquid cooling block filled with liquid working fluid and a heat exchanger filled with liquid working fluid. An outlet of the heat exchanger is connected with an inlet of the liquid cooling block through a first loop pipeline. A first electro-hydraulic micropump is connected into a pipe of the first loop pipeline in series. An outlet of the liquid cooling block is connected with an inlet of the heat exchanger through a second loop pipeline. A second electro-hydraulic micropump is connected into a pipe of the second loop pipeline in series. The liquid cooling system not only solves the high-efficiency cooling problem of a large power electronic device, but also overcomes the defects of conventional mechanical pumps, such as large sizes, high power consumption, large noise, inaccurate flow control, etc. The system has advantages such as no moving parts, reliable operation, low power consumption, easy manufacturing and no need for maintenance. The system can be integrated with chips or channels directly and does not need independent space. The system can be applied to electronic cooling, drug transportation, micro-electro-mechanical system and other fields.

Description

technical field [0001] The invention relates to the field of fluid power and a heat transfer device, in particular to a small liquid cooling system and method driven by an electro-hydraulic power micropump. Background technique [0002] With the development of electronic manufacturing technology, the integration of electronic components is getting higher and higher. Moore's Law states that the transistor density of integrated circuits doubles every 18 months. The higher the integration of electronic components, the greater the heat flux. The reliability and life of electronic components will increasingly depend on the perfection of the thermal control system. Relevant studies have shown that for every 10°C increase in the operating temperature of electronic components, the reliability of the system and the life of electronic components will decrease by about half. At present, the heat dissipation power of high heat flow devices has reached the order of 10^6w / m^2, and the ...

AI Technical Summary

Problems solved by technology

Traditional mechanical pumps have disadvantages such as large volume, high power consumption, high noise, and inaccurate flow control.

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