System-in-package chip and preparation method thereof and device having chip
A system-in-package and chip technology, applied in the field of microelectronics, can solve problems such as difficult to meet the needs of the Internet of Things
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[0046] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0047] figure 2 A block diagram of a SiP module provided for an embodiment of the present invention. Such as figure 2 As shown, the SiP module provided by an embodiment of the present invention includes: a radio frequency front-end module 208; an analog-to-digital converter 206 and a digital-to-analog converter 207; a microcontroller processing unit 200; a system bus unit 201; and a wireless fidelity (WiFi) Base Band / Media Access Control / Radio Frequency (Base Band / Media Access Control / Radio Frequency; BB / MAC / PHY) unit 204, and the microcontroller processing unit (Mirco Controller Unit; MCU) 200 via the system bus unit 201 Connected, used to perform one or m...
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