Packaging method for multi-dimensional power division network of TR (Transmitter and Receiver) assembly

Abstract

The invention discloses a packaging method for a multi-dimensional power division network of a TR (Transmitter and Receiver) assembly. The method comprises the steps of through adoption of a vertical interconnection mode, dividing the TR assembly into three kinds of circuits: a microwave circuit, a digital circuit and a power supply circuit; correspondingly dividing a circuit board into three kinds of circuit layers: a microwave layer, a digital layer and a power supply layer, wherein the circuit lines of the three kinds of circuits are located in the different circuit layers, and the different circuit layers are isolated by employing ground layers; the different circuit layers are interconnected through adoption of a mode of intensive through holes; and a transmitter and receiver unit of the TR assembly is interconnected with the multiple circuit layers through adoption of a mode of microstrip lines and strip lines, the transmitter and receiver unit of the TR assembly is interconnected with an antenna through adoption of an insulator sintering mode, and the devices of the transmitter and receiver unit of the TR assembly are sealed in a transmitter and receiver cavity. According to the TR assembly packaging method, functions such as transceiving and correction of the antenna, formation of a radio frequency beam and a digital interface of a synthesized beam are realized; and the method is relatively high in integration degree, isolation degree and reliability.

Description

technical field [0001] The invention relates to the field of microwave technology, and more specifically, the invention relates to a packaging method for a multi-dimensional power division network of a TR component. Background technique [0002] Microwave components are products assembled using various microwave components (at least one of which is active) and other parts. Microwave components are mostly custom-designed, mainly used for frequency conversion of frequency synthesis systems, through filtering, to ensure performance such as spectrum purity. [0003] TR (Transmitter and Receiver, sending and receiving) component technology is the core of microwave components, and it is an important pillar for the development of various high-tech weapons. It has been widely used in various advanced tactical missiles, electronic warfare, communication systems, land, sea and air bases. Various advanced phased array radars (especially airborne and spaceborne radars). The traditiona...

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Problems solved by technology

On the other hand, there are many human factors doping in the assembly of traditional types of components. The components, components, microwave part of the circuit, and DC part of the circuit need to be re-integrated. During the process, the temperature gradient needs to be artificially designed, and different parts are assembled using different proportions of solder. Long-term repeated sintering will affect the reliability of components, and at the same time, the production efficiency will be low, which will affect the transceiver and correction of the antenna of the whole machine, and the radio frequency beamforming

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