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Heater unit and heat processing device

A technology of heat treatment device and heater, applied in ohmic resistance heating device, heating element, ohmic resistance heating parts and other directions, to achieve the effect of increasing high efficiency

Active Publication Date: 2016-11-09
KOYO THERMO SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, in lithium-ion battery electrodes, NMP is sometimes used as a solvent for the slurry of the current collector coated on the surface of the metal foil, so there is such a danger.

Method used

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  • Heater unit and heat processing device
  • Heater unit and heat processing device
  • Heater unit and heat processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Hereinafter, a heat treatment apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[0043] Such as figure 1 As shown, the heat treatment device 10 includes a heat treatment furnace 1, a heat source 21, a light transmitting member 3 and a gas circulation mechanism 4. The heat treatment device 10 is suitable for heat treatment performed in a relatively low temperature region (for example, 300° C. or less) obtained by using radiant heat.

[0044] The heat treatment furnace 1 includes a frame 11 and a heat insulating layer 12. The frame 11 is made of a material having heat resistance. The heat insulating layer 12 is provided inside the frame 11. With this structure, the heat treatment furnace 1 has heat resistance and heat insulation. It is suitable to use heat insulating materials such as ceramic fibers to form the heat insulating layer 12. In addition, by making the inside of the frame 11 hollow, the heat insulati...

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PUM

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Abstract

The invention provides a heater unit and a heat processing device. The heat processing device (10) comprises a heat processing furnace (1), a heat source (21), a light penetrating component (3) and a gas circulation mechanism (4). The heat processing furnace (1) accommodates a processing part. The heat source (21) radiates infrared ray. The light penetrating component (3) is configured in a manner of facing the heat source (21), thereby isolating the heat source (21) from an atmosphere. The light penetrating component (3) is made of a material which realizes penetration of at least one part of the infrared ray which is radiated from the heat source (21). The gas circulation mechanism (4) is formed for circulating cooling gas in a space (300) which is formed between the heat source (21) and the light penetrating component (3).

Description

[0001] This application is a divisional application of the patent application with the application date of July 09, 2013 and the invention title of "heater unit and heat treatment device" with the application number of 201310286664.4. Technical field [0002] The present invention relates to a heater unit and a heat treatment device, and particularly to a heater unit and a heat treatment device suitable for heat treatment in a relatively low temperature region (for example, 300°C or less) obtained by using radiant heat. Background technique [0003] In order to use heat to vaporize liquid components from liquid droplets adhered to water, organic solvents, or the like, or to-be-processed materials wetted by these liquids, and to dry the to-be-processed materials, a drying device with a heat source is used. [0004] In Patent Document 1, as a drying device for drying water droplets on a silicon wafer, the following technical proposal is proposed: an infrared lamp is used as a heat sour...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/06H01L31/18
CPCH01L31/182H01L31/186H05B3/06Y02P70/50H01L21/67115H05B3/0047
Inventor 中西识藤田翁堂福田洋人巽智彦
Owner KOYO THERMO SYST CO LTD