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Heat-conducting and heat-dissipating film containing graphene

A technology of heat dissipation film and graphene, applied in layered products, chemical instruments and methods, metal layered products, etc., can solve the problems of fragile particle dust, low tensile strength, inconvenient installation and use, etc., to achieve Thin thickness, high processing difficulty, easy to use

Active Publication Date: 2016-11-16
SHENZHEN LAIBIDE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, graphite heat dissipation film is mainly made by direct calendering after graphite treatment and polymer carbonization, graphitization and other methods. The heat dissipation material with graphite surface has low tensile strength, is fragile, has many particles and dust, and is inconvenient. installation and use

Method used

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  • Heat-conducting and heat-dissipating film containing graphene
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  • Heat-conducting and heat-dissipating film containing graphene

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, the graphene heat-conducting and heat-dissipating film includes a heat-dissipating film body 1, and the heat-dissipating film body 1 includes a graphene composite film layer 2, and the graphene composite film layer 2 includes a graphene layer 21 and a first substrate 22, so The first substrate 22 and the graphene layer 21 are composited by the first adhesive layer 23, the thickness of the graphene layer 21 is 0.001 μm, and the purity of the graphene layer 21 is 99.5%. The bottom surface and the top surface of the graphene composite film layer 2 are respectively provided with a first adhesive layer 3 and a second adhesive layer 4 . Through the first adhesive layer 3 and the second adhesive layer 4, it is convenient to be fixed with the heat generating body that needs to dissipate heat.

[0026] Preferably, the first base material 22 is copper foil, and the thickness of the first base material 22 is 0.001 μm. Copper foil has good calendering p...

Embodiment 2

[0033] Such as figure 2 As shown, the graphene heat-conducting and heat-dissipating film includes a heat-dissipating film body 1, and the graphene composite film layer 2 includes a graphene layer 21, a first substrate 22 and a second substrate 24, and the first substrate 22 and the The graphene layer 21 is bonded to each other by the first bonding layer 23, and the second substrate 24 and the graphene layer 21 are composited by the second bonding layer 25. The graphene layer 2 The thickness is 2 μm, and the purity of the graphene layer 2 is 99.9%. Wherein, the graphene layer 2 is high-purity graphene, and the bottom surface and the top surface of the graphene composite film layer 2 are respectively provided with a first adhesive layer 3 and a second adhesive layer 4 .

[0034] Preferably, the first substrate 22 and the second substrate 24 are aluminum foil, and the thickness of the first substrate is 2 μm.

[0035] Preferably, the first bonding layer 23 and the second bondi...

Embodiment 3

[0042] Such as image 3 As shown, the graphene heat-conducting and heat-dissipating film includes a heat-dissipating film body 1, and the graphene composite film layer 2 includes a first graphene layer 21, a first base material layer 22 and a second graphene layer 24, and the first graphite The graphene layer 21 and the first substrate 22 are bonded together by a first adhesive layer 23, and the second graphene layer 24 and the first substrate 22 are composited by a second adhesive layer 25 , the thickness of the first graphene layer 21 and the second graphene layer 24 is 1 μm, the purity of the first graphene layer 21 and the second graphene layer 24 is 99.7%, and the graphene The bottom surface and the top surface of the composite film layer 2 are respectively provided with a first adhesive layer 3 and a second adhesive layer 4 .

[0043] Preferably, the first substrate 22 is a PI plastic film, and the thickness of the first substrate 22 is 1000 μm. PI plastic film has exc...

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Abstract

The invention relates to the technical field of a heat-conducting and heat-dissipating material, in particular to a heat-conducting and heat-dissipating film containing graphene. The heat-conducting and heat-dissipating film containing graphene comprises a heat-dissipating film body, wherein the heat-dissipating film body comprises a graphene composite film layer, the graphene composite film layer is formed by compositing a graphene layer and a base material through a bonding layer, the thickness of the graphene layer is in a range of 0.001-50.0 mu m, the purity of a graphene layer is in a range of 99.5%-99.99%, and a first adhesive layer and a second adhesive layer are arranged on the bottom surface and the top surface of the graphene composite film layer respectively. Compared with the prior art, the heat-conducting and heat-dissipating film containing graphene has the beneficial effects as follows: the heat-dissipating film body comprises the graphene composite film layer, the graphene composite film layer is formed by compositing the graphene layer and the base material through the bonding layer, and the heat-conducting and heat-dissipating film containing graphene has toughness, can be produced automatically and continuously, can be stored in a rolled manner, is convenient to use and good in heat-conducting and heat-dissipating effect, is fixed through bonding, and can be widely applied to heat conduction and heat dissipation of devices such as a laptop, a mobile phone, a television, a camera, an LED lamp, an automobile cooling fin and the like.

Description

technical field [0001] The invention relates to the technical field of heat-conducting and heat-dissipating materials, in particular to graphene heat-conducting and heat-dissipating films. Background technique [0002] With the rapid development of modern technology, the miniaturization of electronic devices, the continuous increase of the main frequency of the chip, the increasing function, and the gradual increase of the power consumption of a single chip, all of these lead to a sharp increase in heat flux. Studies have shown that more than 55% of electronic devices fail in the form of overheating, so the heat dissipation of electronic devices plays a decisive role in the development of electronic devices. [0003] At present, some products in the market use metal materials for heat conduction and heat dissipation, especially copper and aluminum. Although the thermal conductivity of copper is 398W / mK, its heavy weight and easy oxidation limit its application, while the the...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B15/20B32B7/10B32B33/00
CPCB32B7/10B32B9/007B32B9/041B32B15/20B32B33/00B32B2307/302B32B2307/558
Inventor 吴付东
Owner SHENZHEN LAIBIDE TECH CO LTD
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