Bidirectional integrated embedded-type POP packaging structure and manufacturing method thereof

Abstract

The invention relates to a bidirectional integrated embedded-type POP packaging structure and a manufacturing method thereof. The structure comprises a first packaging body and a second packaging body, wherein the first packaging body comprises a first circuit layer (1); the front surface of the first circuit layer (1) is provided with a first connection copper column (2); a first insulated material (3) packages the first circuit layer (1); the front surface of the first insulated material (3) is provided with a second circuit layer (4); the front surface of the second circuit layer (4) is provided with a second connection copper column (5) and a first element (7); a second insulated material (6) packages the second circuit layer (4); the back surface of the first insulated material (3) is provided with a third connection copper column (8) and a second element (9); and a third insulated material (10) packages the third connection copper column (8). Multi-layer bidirectional embedding can be realized, the surface mount number of passive devices is more, the substrate space can be effectively saved, and the packaging process integration is improved.

Description

technical field [0001] The invention relates to a two-way integrated embedded POP packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of electronic devices towards high functionality and miniaturization, the proportion of passive devices in electronic systems is also increasing. At present, passive devices are mainly surface-mounted, which not only occupies a large amount of space on the surface of the substrate, but also has a large number of solder joints on the surface and a long interconnection length, which greatly reduces the electrical performance and reliability of the system. In order to save the surface space of the circuit board / substrate and provide thinner, better performance, and more reliable electronic systems, surface mount passive devices are transformed into embeddable passive devices, and all active components are buried The ultimate three-...

AI Technical Summary

Problems solved by technology

The current traditional three-dimensional packaging structure such as figure 1 As shown, the production method is to embed passive and active components on one side of the substrate, press or coat insulating materials, and use laser drilling and electroplating blind hole technology to lead the underlying functions to the second connection layer and then make the circuit layer. It still has the following disadvantages: the conventional substrate is easily deformed and thick, which is not conducive to improving the packaging integration; the laser drilling and electroplating blind hole process has low precision and poor heat dissipation and electrical properties, especially for high-frequency and high-power products.

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