Automatic adhesive paper pasting equipment

Abstract

The invention discloses automatic adhesive paper pasting equipment which comprises a lower control mechanism and an upper operating mechanism. The upper operating mechanism comprises a steel frame, an operating platform, an upper hood and an image visual module, wherein a vertical template is fixed to the steel frame, a groove in the vertical direction is formed in the template, and a blanking module is mounted in the groove. A cutting die is horizontally fixed below the blanking module, and a flat channel layer is arranged in the cutting die. A conveying mechanism is arranged on one side of the flat channel layer, and a recovery mechanism is arranged on the other side of the flat channel layer. The conveying mechanism comprises an adhesive paper separator. A moving mechanism used for horizontally placing a circuit board is arranged in the steel frame and comprises a horizontally arranged jig. By means of the automatic adhesive paper pasting equipment, automatic production in an adhesive paper pasting procedure can be achieved, the cleanliness of adhesive paper pasting materials is guaranteed, separation of the adhesive paper pasting materials from release paper on the adhesive paper pasting materials is guaranteed, a winding phenomenon is avoided, and production efficiency is greatly improved.

Description

technical field [0001] The invention relates to an automatic sticking equipment for glued paper. Background technique [0002] In the field of circuit board processing, especially for the processing of flexible circuit boards, when FPC is fixed inside electronic products, some products, especially flexible circuit boards, will be fixed with adhesive tape. In this process, the adhesive tape must first be punched into the adhesive tape patch required by the circuit board, and then the cut and punched adhesive tape patch should be pressed on the predetermined position of the flexible circuit board to make it close to the flexible circuit board. board. [0003] In most cases at present, manual processing or existing mechanism processing is generally used. When manual operation is adopted, there are the following disadvantages: during manual operation, it is difficult to control the lamination force of the adhesive tape and the flexible circuit board; It causes damage to the c...

AI Technical Summary

Problems solved by technology

When manual operation is adopted, there are the following disadvantages: during manual operation, it is difficult to control the lamination force of the adhesive tape and the flexible circuit board; Causes damage to the circuit board, and the efficiency of manual operation is not high, the accuracy of manual placement is poor, and there is a rework rate, which affects production capacity and product quality

When using manual placement, each person’s efficiency is different. The daily output, the factory has no way to quantitatively output, so as to obtain a large number of orders; now there are difficulties in recruiting workers in coastal areas, high turnover rate, frequent personnel replacement, affecting production capacity and product quality

[0004] The existing mechanism processing, the existing equipment is too large, the entire facility occupies a large space, the mutual operation between the mechanisms is not consistent, and the positioning accuracy is not high; and the use efficiency of the tape material is not high, resulting in low production efficiency and production The cost is high, and it is difficult to meet the development requirements of production

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