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High-speed copper plating device

A high-speed plating and copper plating technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of reduced plant space utilization, low equipment utilization, and affecting work efficiency, so as to shorten the occupation The effect of small area, saving floor area, and fast production

Active Publication Date: 2016-11-23
德州市立尊焊丝有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The welding wire in the existing copper plating tank operates independently, the production line is long, the equipment utilization rate is low, the floor space is large, and the plant space utilization rate is greatly reduced, which greatly affects the work efficiency

Method used

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  • High-speed copper plating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] As attached Figure 1-4 As shown, the high-speed copper plating device includes a copper plating tank 1 and a mother liquid tank 2. The mother liquid tank 2 is arranged under the copper plating tank 1 and connected to the copper plating tank. A pump is provided behind the copper plating tank 1 and the mother liquid tank 2. Body 3, the inlet of the pump body 3 is connected with the liquid outlet of the mother liquor tank 2 through a pipeline, and the outlet of the pump body 3 is connected with the liquid inlet of the copper plating tank 1 through the pipeline; a copper plating tank 1 is provided with a copper plating tank 1 The tank cover 4 is hingedly connected at the top and rear end of the tank. On the inner rear side wall of the copper plating tank 1, a first sub tank 5 and a second sub tank 6 are arranged horizontally and in parallel from top to bottom; in the first sub tank 5 2. On the rear side wall of the copper plating tank 1 on the left and right sides of the sec...

Embodiment 2

[0030] As attached Figure 5-7 As shown, the high-speed copper plating device includes a copper plating tank 1 and a mother liquid tank 2. The mother liquid tank 2 is arranged under the copper plating tank 1 and connected to the copper plating tank. A pump is provided behind the copper plating tank 1 and the mother liquid tank 2. Body 3, the inlet of the pump body 3 is connected with the liquid outlet of the mother liquor tank 2 through a pipeline, and the outlet of the pump body 3 is connected with the liquid inlet of the copper plating tank 1 through the pipeline; a copper plating tank 1 is provided with a copper plating tank 1 The tank cover 4 is hingedly connected at the top and rear end of the tank. On the inner rear side wall of the copper plating tank 1, a first sub tank 5 and a second sub tank 6 are arranged horizontally and in parallel from top to bottom; in the first sub tank 5 2. On the rear side walls of the copper plating tank 1 on the left and right sides of the s...

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Abstract

The invention relates to the technical field of equipment for welding wire production, in particular to a high-speed copper plating device. The high-speed copper plating device comprises a copper plating tank and a mother liquid tank. A pump body is arranged behind the copper plating tank and the mother liquid tank. A first auxiliary tank and a second auxiliary tank are arranged in the copper plating tank. Wire winding discs are arranged on the two sides of the first auxiliary tank and the second auxiliary tank. Wire winding grooves are formed in the wire winding discs. A wire penetrating groove is formed in the side wall of each of the first auxiliary tank and the second auxiliary tank. The inner rear side wall of the copper plating tank is connected with a first liquid inlet pipe and a second liquid inlet pipe. A liquid collecting cavity is formed in the mother liquid tank. The top face of the part, outside the liquid collecting cavity, of the mother liquid tank is obliquely arranged. A wire inlet pipe opening is formed in the left side wall of the copper plating tank, and a wire outlet pipe opening is formed in the right side wall of the copper plating tank. A gas blowing pipe is arranged on the rear side wall of the part, behind the wire outlet pipe opening, of the copper plating tank. The gas blowing pipe is connected with a gas storage tank. The high-speed copper plating device is high in surface treatment speed, the length of the whole equipment is greatly reduced, environment friendliness is achieved, and the occupied area of welding wire surface treatment equipment is saved.

Description

(1) Technical field [0001] The invention relates to the technical field of equipment for welding wire production, in particular to a high-speed copper plating device. (2) Background technology [0002] The existing welding wire is processed by drawing a wire with a larger diameter to make the welding wire. In order to prevent rust and improve the conductivity of the welding wire, the welding wire needs to be copper-plated. The copper plating of the welding wire is carried out on the continuous copper plating production line of the welding wire. Generally, the to-be-processed welding wire discharged from the pay-off mechanism is subjected to alkaline washing, water washing, acid washing and activation treatment, and then washed in the copper plating tank for copper plating. The welding wire in the existing copper plating tank runs independently, the production line is long, the equipment utilization rate is low, the area is large, and the plant space utilization rate is greatly re...

Claims

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Application Information

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IPC IPC(8): C23C18/38
CPCC23C18/1637C23C18/1646C23C18/38
Inventor 薛建文陈玉峰刘少瑞孙俊生
Owner 德州市立尊焊丝有限公司
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