Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic component and printed wiring board

A technology of electronic components and printed substrates, applied to printed circuit components, printed circuits, printed circuits, etc., can solve problems such as system shutdown, malfunction, and cost increase

Inactive Publication Date: 2016-12-07
FANUC LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even if it is broken, it will not directly affect the operation of the system, so that it can prevent the system from shutting down when the corner terminal is broken, but there is no technology that knows that the breakage has occurred
In addition, when further stress is applied and deterioration continues, terminals other than the corner terminals may also break, and the system may shut down
[0008] In addition, in the method disclosed in Japanese Patent Application Laid-Open No. 10-011558, external components are required, and the external terminal is driven by a pull-up resistor, so the impedance becomes high, and there is a possibility of malfunction due to the influence of noise in an FA environment, etc.
In addition, in the method disclosed in Japanese Patent Application Laid-Open No. 07-218582, it is necessary to install a detection circuit externally, which increases the cost.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component and printed wiring board
  • Electronic component and printed wiring board
  • Electronic component and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] use figure 1 , Figure 2A , Figure 2B , Figure 2C , Figure 2D A first embodiment for carrying out the present invention will be described. figure 1 BGA means that a plurality of terminals 2 are arranged on the back surface (bottom surface) of the package of the electronic component 1 . The electronic component 1 is a packaged component such as BGA, LGA, or CSP.

[0040] When the electronic component 1 is a BGA, the terminals 2 are configured as electrodes (bumps) formed hemispherically toward the terminals arranged in a grid on the bottom surface of the package. Hereinafter, regarding the terminal, the electrode formed in a hemispherical shape is simply referred to as the terminal 2 . Pads 9 are provided on the printed circuit board 11 . The electronic component 1 is mounted on the printed substrate 11 by soldering each terminal 2 of the electronic component 1 to the pad 9 provided on the printed substrate 11 . The pad 9 is circular in shape, but may also be ...

Embodiment approach 2

[0052] The basic structure of the second embodiment of the present invention is the same as that of the first embodiment. Figure 5A , Figure 5B It is a diagram showing the configuration of a detection circuit according to Embodiment 2 of the present invention. Figure 5A It shows the state where the connection breakage of the detection terminal 3 and the pad 9 has not occurred. Figure 5B It shows the state where the fracture|rupture which peeled off the connection of the detection terminal 3 and the pad 9 has occurred.

[0053] The electronic component 1 also has a latch circuit 13, and the first binary signal (binarized signal) output by the input buffer 7 is input to the latch circuit 13, and the latch circuit 13 is characterized by: outputting the second binary signal The signal (binarized signal) outputs the first level as the second binary signal while the first binary signal input from the input buffer 7 is at the first level. When the value signal reaches the seco...

Embodiment approach 3

[0065]The basic structure for implementing the third embodiment of the present invention is the same as that of the first embodiment. The electronic component is configured to include a reset terminal at a certain terminal. When the reset terminal is validated from the outside (when a reset signal is input), the latch circuit is initialized.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

It is an object of the present invention to provide an electronic component and a printed wiring board which do not require an external circuit and have a function of detecting a defective contact between the electronic component and the solder connection portion between the printed wiring board and a socket. The electronic component having a plurality of terminals arranged on a bottom side of a package and mounted on a printed wiring board includes at least one detection terminal as a portion of the plurality of terminals, the detection terminal being connected to a ground outside the electronic component, wherein the detection terminal is connected to an input port of an input buffer and one end of a resistor inside the electronic component, the other end of the resistor is connected to a power supply, and the input buffer detects a poor connection of a solder joint or a socket by outputting a first binary signal obtained by binarizing a voltage level input into the input buffer using a predetermined threshold.

Description

technical field [0001] The present invention relates to an electronic component having a function of detecting poor soldering, damage, and deterioration of a solder joint with a substrate, and poor contact of a socket. Furthermore, the present invention relates to a printed circuit board on which the above-mentioned electronic components are mounted. Background technique [0002] The present invention relates to an electronic component having a function of detecting poor soldering, damage, and deterioration of a solder joint with a substrate, and poor contact of a socket. Furthermore, the present invention relates to a printed circuit board on which the above-mentioned electronic components are mounted. [0003] Electronic components in packages such as BGA (Ball Grid Array), LGA (LandGrid Array), and CSP (Chip Size Package) mounted on printed substrates are known to experience thermal stress or vibration / shock , bending of the substrate, etc., there is a tendency that a l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0266H05K2203/16H05K3/3436H05K2201/10719H05K2201/10734H05K2203/162G01R31/2812H01L22/32H01L22/34H01L2224/131H01L2224/16227H01L2924/014H03K19/20
Inventor 小松孝彰佐古田恭庸
Owner FANUC LTD