Novel epoxy compound, mixture, composition, and cured product comprising same, method for preparing same, and use thereof

Abstract

The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant properties - specifically, a low thermal expansion property and a high glass transition temperature increasing effect (including Tg-less which does not show a glass transition temperature), a flame retardant property and processability - specifically, a thickening-control property without requiring a separate silane coupling agent, and has improved brittleness in a complex. According to one aspect of the present invention, provided are: an epoxy compound having at least one unreactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product. The epoxy composition comprising the novel epoxy compound of the present invention exhibits enhanced heat-resistant properties - i.e., a glass transition temperature increasing effect and a reduced CTE of the epoxy complex due to the formation of a chemical bond through a chemical reaction between the alkoxysilyl group and a filler and a chemical reaction between alkoxysilyl groups in the complex and / or a cured product. Further, the cured product of the epoxy composition of the present invention exhibits an excellent flame retardant property due to introduction of the alkoxysilyl group. In addition, thickening of the epoxy composition of the present invention can be easily controlled during a curing reaction. Furthermore, the cured product of the epoxy composition exhibits improved brittleness.

Description

technical field [0001] The present invention relates to novel epoxy compounds which exhibit improved processability and The invention relates to brittleness and excellent heat resistance, relates to a mixture, a composition and a cured product containing the epoxy compound, and relates to a preparation method and application of the epoxy compound. In particular, the present invention relates to novel epoxy compounds having excellent heat resistance, in particular a low coefficient of thermal expansion and a high glass transition temperature (including exhibiting no glass transition temperature), among composite materials as described above. Transition temperature without Tg), flame retardant properties and processability, specifically controllable viscosity without the need for a separate silane coupling agent, and improved brittleness, relating to mixtures, compositions and cured products comprising said epoxy compounds The invention relates to a preparation method and appli...

AI Technical Summary

Problems solved by technology

However, the problem of increased viscosity can become more severe with the use of fillers with diameters less than or equal to 1 micron

Furthermore, in the case of the use of inorganic particles with a larger average diameter, the probability that the composition containing resin and inorganic particles is not properly filled into the applied assembly increases

On the other hand, in the case of using compositions containing organic resins and fibers as fillers, the CTE can be significantly reduced, but the CTE of the composite is still higher compared to silicon chips etc.

[0006] Due to the limitations of the current composite technology of epoxy resins as mentioned above, the application of epoxy resins in highly integrated, high-performance electronic components such as next-generation semiconductors and PCBs is limited

Therefore, there is a need to develop epoxy composites with improved thermal expansion properties such as low CTE and high glass transition temperature to solve the problems such as high CTE in existing thermosetting polymer composites and caused by the high CTE of composites Insufficient heat resistance and processability of

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