Conveying turnover device for plastic sealing strip of integrated circuit

A technology of integrated circuits and flipping devices, applied in printed circuits, auxiliary devices, auxiliary welding equipment, etc., can solve the problems of low efficiency, many equipment and operators, and high production costs, and achieve convenient operation, simple structure, and improved production efficiency Effect

Active Publication Date: 2017-01-04
华天科技(宝鸡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a conveying and flipping device for integrated circuit molding compound strips to solve the problems of high production cost and low efficiency caused by the need for equipment and operators when laser marking the front and back of integrated circuit molding compound strips

Method used

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  • Conveying turnover device for plastic sealing strip of integrated circuit
  • Conveying turnover device for plastic sealing strip of integrated circuit

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Experimental program
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Embodiment Construction

[0017] In order to better understand the present invention, it will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0018] Such as Figure 1-2 As shown, a conveying and turning device for integrated circuit molding compound strips includes a conveying mechanism 2 and a turning mechanism 3, wherein the conveying mechanism 2 includes two mutually parallel guide rails 2-3, and the guide rails 2-3 are provided with pulleys 2-4 , the belt pulley 2-4 is provided with a conveyor belt 2-5, and two guide rails 2-3 are erected on the belt bearing holders 2-1 at both ends of the guide rail 2-3 through the rotating shaft 2-2, and one of the guide rails 2-3 An overturning mechanism 3 is provided on the outside, and the fixed seat 2-1 with bearings is fixed on the horizontal operating platform 1; -3 vertical setting, slide rail 3-2 is provided with fixed base 3-3, is provided with some linear bearings 3-14 on the fixed base 3-3, is respe...

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Abstract

The invention discloses a conveying turnover device for a plastic sealing strip of an integrated circuit and belongs to the field of integrated circuit package auxiliary equipment. The conveying turnover device mainly comprises a horizontal operation platform, a belt conveying mechanism and a strip turnover mechanism. The packaged integrated circuit strip is conveyed to a front side marking position; after the front side is marked, the strip is conveyed to the strip turnover mechanism for overturning for 180 degrees; and then, the strip is conveyed to a rear side marking position for marking the rear side. According to the invention, the positive and negative laser marking for the integrated circuit strip is simultaneously performed on a same device, so that the production cost of the products is effectively lowered and the production efficiency of the products is increased; the structure is simple and the operation is convenient; and the conveying turnover device is suitable for the marking operation of the plastic sealing strips of the integrated circuits in different sizes by adjusting the heights of a reset spring and a reset rod on an upper flipper-shaped clamp plate and a lower flipper-shaped clamp plate.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging auxiliary equipment, in particular to an integrated circuit plastic sealing material strip conveying and turning device that can effectively reduce production costs and improve laser marking efficiency. Background technique [0002] Laser marking is an indispensable link in the packaging of integrated circuit boards. The current marking operation is to complete the front marking on one device, and then manually transfer it to another device for reverse marking. The operation requires at least two operators and two sets of equipment to work at the same time, the process is cumbersome, the production cost is high, and the material strip is easy to cause damage during the transfer process; in today's competitive environment of the integrated circuit packaging industry, it is necessary to reduce costs and improve production efficiency And the quality of finished products is the core of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B23K26/362B23K37/047
CPCB23K26/361B23K26/702B23K37/047B23K2101/42B23K2103/42
Inventor 尹文斌蔡志元
Owner 华天科技(宝鸡)有限公司
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