Interface sealing device for semiconductor interface unit

Abstract

The invention belongs to the field of wafer photoresist-coating and developing production technology in a semiconductor industry, and particularly relates to an interface sealing device of a semiconductor interface unit. The interface sealing device is arranged at two side interface parts of an interface unit which is connected with a TRACK and a photoetching machine. The interface sealing device comprises sealing baffle plates, a sealing rack and a driving device, wherein the sealing baffle plates are arranged at the edge of the interface parts of the interface unit. The driving device is arranged on the frame of the interface unit. The sealing rack is arranged in the interface part of the interface unit and is connected with the driving device. The sealing rack extends out of or retreats from the two side interface parts of the interface unit. On the condition that the sealing rack extends out of the interface part and the inside end of the sealing rack abuts against the sealing baffle plate, the outside end of the sealing rack abuts against the TRACK and the photoetching machine, thereby sealing slits between the two side interface parts of the interface unit and the TRACK and the photoetching machine. The interface sealing device has advantages of preventing entry of outer air into inner part of equipment, keeping a clean environment in the equipment, and ensuring a fact that the wafer processing process is performed in the environment which satisfies a cleanness requirement.

Description

technical field [0001] The invention belongs to the technical field of wafer gluing and development production in the semiconductor industry, in particular to an interface sealing device for a semiconductor interface unit. Background technique [0002] In the semiconductor manufacturing process, the requirements for the cleanliness of the environment are very high. In the actual production process of TRACK (glue developing machine) and lithography machine, an interface unit is required to transfer wafers between TRACK and lithography machine. At this stage, the side opening of the interface unit connected to TRACK or lithography machine is open, which is directly exposed to the external environment. As a result, during the operation of the equipment, the external air can easily pollute the internal environment of the equipment, seriously affecting the performance of the process. Contents of the invention [0003] In view of the above problems, the object of the present inv...

AI Technical Summary

Problems solved by technology

At this stage, the side opening of the interface unit connected to TRACK or lithography machine is open, which is directly exposed to the external environment. As a result, during the operation of the equipment, the external air can easily pollute the internal environment of the equipment and seriously affect the performance of the process.

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