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GaN-based enhanced device with gallium nitride insertion layer and preparation method thereof

A gallium nitride-based, insertion layer technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of adverse effects of channels, unfavorable industrial production, poor controllability, operability and repeatability, etc. The effect of reducing the influence of the channel

Inactive Publication Date: 2017-01-04
PEKING UNIV
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  • Claims
  • Application Information

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Problems solved by technology

However, in the existing methods for realizing GaN-based enhancement devices, the controllability, operability and repeatability are generally poor, which is not conducive to industrial production
In addition, for enhancement-mode devices, it is also valuable to be able to easily control the threshold voltage during the material and device fabrication process, and most gate groove preparation techniques will obviously have an adverse effect on the channel

Method used

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  • GaN-based enhanced device with gallium nitride insertion layer and preparation method thereof
  • GaN-based enhanced device with gallium nitride insertion layer and preparation method thereof
  • GaN-based enhanced device with gallium nitride insertion layer and preparation method thereof

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Embodiment Construction

[0041] The present invention will be described in detail below through specific embodiments and accompanying drawings.

[0042] The principle that the present invention can realize a high-performance recessed gate gallium nitride-based enhancement device based on self-stop etching and controllable threshold voltage is: in gallium nitride-based materials such as AlGaN / GaN, InGaN / GaN, and InAlN / GaN , because GaN has higher oxidation resistance than other material layers such as AlGaN, during the oxidation treatment, the material layers such as AlGaN are oxidized without affecting the GaN layer (including the unetched cap layer, insertion layer and under the barrier layer) GaN channel layer and buffer layer, etc.), the formed oxide is easily corroded by alkaline solution such as KOH, and the alkaline solution has no effect on the GaN layer, and the corrosion process stops at the GaN insertion layer, so self-stop concave can be realized. Slot grid structure. Since the thickness o...

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Abstract

The invention discloses a GaN-based enhanced device with a gallium nitride insertion layer and a preparation method thereof. Since a gallium nitride layer is inserted into a barrier layer, in the preparation of a groove gate structure, corrosion can be stopped at the gallium nitride insertion layer automatically, so that different depths of groove corrosion effects can be realized through different insertion positions of the gallium nitride layer in the barrier layer, and control and adjustment of Schottky gate and MOS structure gate threshold voltage can be finished based on the structure above; the left barrier layer in proper thickness under the gallium nitride insertion layer can protect the trenches during groove corrosion effectively to prevent degradation of device performance; and the GaN-based enhanced device and the preparation method thereof have higher operability and repeatability, and facilitate industrial production.

Description

technical field [0001] The invention belongs to the field of gallium nitride-based devices in semiconductor technology, and in particular relates to a gallium nitride-based enhanced device with a gallium nitride insertion layer and a preparation method thereof. Background technique [0002] Devices based on AlGaN / GaN, InGaN / GaN, InAlN / GaN, etc. are collectively referred to as gallium nitride-based devices, such as AlGaN / GaN heterostructure field effect transistors (heterostructure field effect transistors, HFET), heterojunction bipolar Transistor (heterostructure bipolar transistor, HBT), etc. Gallium nitride-based devices have the advantages of strong breakdown field, high electron mobility, and high saturation speed. They are considered to be strong competitors for the next generation of power switching devices, and have been favored by researchers in recent years. [0003] Due to the strong spontaneous polarization and piezoelectric polarization effects, GaN-based device...

Claims

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Application Information

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IPC IPC(8): H01L29/778H01L29/06H01L29/423H01L29/66H01L21/28
CPCH01L29/7787H01L29/0684H01L29/4236H01L29/66462
Inventor 刘靖骞王金延徐哲王茂俊于民吴文刚张进城马晓华郝跃
Owner PEKING UNIV
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