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Plate fin type micro-circulation radiator and micro-circulation heat exchange system

A radiator and plate-fin technology, which is applied in the field of plate-fin microcirculation radiator and microcirculation heat exchange system, can solve the problem that the radiator cannot meet the heat dissipation requirements, and achieve auxiliary power saving, low noise, and compact heat exchange system Efficient effect

Active Publication Date: 2017-01-04
CRRC DALIAN INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the traditional radiator proposed above cannot meet the heat dissipation requirements under the conditions of high power and high heat flux density, and researches and designs a plate-fin microcirculation radiator and a microcirculation heat exchange system

Method used

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  • Plate fin type micro-circulation radiator and micro-circulation heat exchange system
  • Plate fin type micro-circulation radiator and micro-circulation heat exchange system
  • Plate fin type micro-circulation radiator and micro-circulation heat exchange system

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Embodiment Construction

[0037] Such as figure 1 and figure 2 As shown, a plate-fin microcirculation radiator includes a heat source module mounting plate 4 for installing a heat source module 3, a radiator mounting plate 5 and a heat dissipation assembly, and the heat source module mounting plate 4 and the radiator mounting plate 5 are fixed to each other And the main working medium cavity 6 for accommodating the working medium 8 is formed inside. The heat dissipation assembly is installed on the radiator mounting plate 5. The heat dissipation assembly includes microcirculation heat dissipation modules 9 and cooling air passages 17 arranged at intervals. The microcirculation heat dissipation module 9 includes two partitions 21 and the division mass cavity seal 20 arranged at the two ends of the partition 21, the partition 21 and the division mass cavity seal 20 surround the division mass cavity 10 on all sides, and the cooling air channel 17 There are heat dissipation fins 12 inside, and the divisi...

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Abstract

The invention discloses a plate fin type micro-circulation radiator and a micro-circulation heat exchange system. The plate fin type micro-circulation radiator comprises a heat source module mounting plate, a radiator mounting plate and a heat dissipation assembly, wherein the heat source module mounting plate and the radiator mounting plate are fixed to each other, main working medium chambers used for containing mediums are formed in the heat source module mounting plate and the radiator mounting plate, the heat dissipation assembly is mounted on the radiator mounting plate and comprises a micro-circulation heat dissipation module and a cooling air passage which are arranged at an interval, the interior of the micro-circulation heat dissipation module is a sub-working medium chamber, and the inner walls of both the main working medium chambers and the sub-working medium chamber are provided with imbibition micro-passages of a capillary structure. The plate fin type micro-circulation radiator and the micro-circulation heat exchange system are compact in structure, high in heat transfer efficiency, relatively low in noise, low in assisting power consumption, high in reliability, capable of well solving the main bottleneck problem, namely the heat dissipation problem of industrial development of electronic components, and broad in market prospect.

Description

technical field [0001] The invention relates to a radiator, in particular to a plate-fin microcirculation radiator and a microcirculation heat exchange system. Background technique [0002] With the development of science and technology, the miniaturization and high integration of high-power and high-performance electronic component application systems have led to a sharp increase in the calorific value of electronic equipment per unit volume and excessive local temperatures. When electronic components are in a high temperature state for a long time, they often fail due to overheating. In addition, when the use environment has strict restrictions on the volume and weight of the heat exchange system and the heat dissipation requirements are still high, it is difficult for the traditional forced liquid circulation cooling method, forced air cooling method or gravity heat pipe phase change cooling method to meet the requirements of high power, The heat dissipation requirement ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20336H05K7/2039
Inventor 刘俊杰迟兴国谭文才陈伟超孔丽君
Owner CRRC DALIAN INST CO LTD
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