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Target material component and preparation method thereof

A production method and target technology, which are applied in the direction of manufacturing tools, tool holder accessories, turning equipment, etc., can solve the problems affecting the quality of sputtering deposition, insufficient vacuum degree of the deposition chamber, etc., and achieve the effect of improving the vacuum degree

Inactive Publication Date: 2017-01-11
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, in the process of sputtering deposition, the problem of insufficient vacuum in the deposition chamber often occurs, which affects the quality of sputtering deposition

Method used

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  • Target material component and preparation method thereof
  • Target material component and preparation method thereof
  • Target material component and preparation method thereof

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Embodiment Construction

[0046] As mentioned in the background art, in the prior art, during the sputtering deposition process, the problem of insufficient vacuum in the deposition chamber often occurs, which affects the quality of the sputtering deposition.

[0047] Analyzing the cause of insufficient vacuum in the deposition chamber, it is found that the sealing component in the prior art is very easy to fall off from the sealing groove, thus resulting in insufficient vacuum in the deposition chamber.

[0048] In order to solve the above problems, the present invention provides a target assembly and a manufacturing method thereof, so that the sealing component is not easy to fall out of the sealing groove, thereby increasing the vacuum degree of the target assembly in the deposition chamber.

[0049]The manufacturing method of the target assembly of the present invention includes: providing a target assembly, and processing a sputtering surface and a sealing surface surrounding the sputtering surface...

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Abstract

A target material component and a preparation method thereof are disclosed, the target material component is provided with a sputtering surface and a sealing surface surrounding the sputtering surface, a seal groove is arranged on the sealing surface of the target material component, and is used for accommodating a sealing part, and the dimension of the widest position of the inside of the seal groove is larger than the dimension of the opening of the seal groove. When the sealing part with the dimension larger than the dimension of the opening of the seal groove is put into the seal groove, the sealing part is clamped in the opening of the seal groove, the sealing part is not easy to remove from the seal groove, and the vacuum degree of the target material component in a deposition chamber can be effectively improved. The preparation method of the target material component can be used for making the target material component.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a target component and a manufacturing method thereof. Background technique [0002] Sputtering deposition (Sputtering Deposition, SD) is a kind of physical vapor deposition (Physical Vapor Deposition, PVD). A sputtering target is used in the sputtering deposition process. The sputtering target is bombarded by high-energy particles during the sputtering process. The atoms or molecules of the sputtering target leave the solid and enter the gas, and the precipitate accumulates in the film formed on the substrate surface. [0003] In order to minimize the impurity interference during the sputtering process and ensure the quality of the deposited film, the deposition chamber where the sputtering target is located is generally evacuated during sputtering, and continuously pumped into the deposition chamber during the sputtering process. Pass in an inert gas (such as argon)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34B23B1/00B23B27/00
Inventor 姚力军潘杰相原俊夫大岩一彦王学泽张良进
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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