Laser-sealed heat-conducting jig and laser-sealed method for organic light-emitting display device

A light-emitting display and laser technology, used in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as large residual stress on the cover plate and poor packaging, and achieve the effect of improving life and avoiding micro-cracks.

Active Publication Date: 2019-03-15
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Problems solved by technology

[0003] Based on this, it is necessary to provide a heat-conducting jig for laser sealing with reduced stress and good packaging for the problems of large residual stress on the cover plate and poor packaging during the laser sealing process of existing organic light-emitting display devices.

Method used

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  • Laser-sealed heat-conducting jig and laser-sealed method for organic light-emitting display device
  • Laser-sealed heat-conducting jig and laser-sealed method for organic light-emitting display device
  • Laser-sealed heat-conducting jig and laser-sealed method for organic light-emitting display device

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0025] Unless otherwise defined, all technical and scientific ter...

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Abstract

The present invention relates to the field of organic display technology, and specifically discloses a laser-sealed heat-conducting fixture for an organic light-emitting display device, which includes a substrate, a transparent area capable of transmitting laser light, and heat-conducting areas located on both sides of the transparent area; and heat-conducting layer, attached to the thermally conductive area of ​​the substrate. With the above-mentioned laser sealing heat conduction fixture, when the glass frit is scanned by laser, the heat of the package cover in the area near the laser spot can be dissipated quickly through the substrate and the heat conduction layer, thereby preventing the heat from accumulating on the package cover and reducing the residue of the package cover. of stress. In this way, when the package cover is cut, cutting defects such as edge chipping and corner chipping can be avoided. In addition, the heat conduction fixture can quickly dissipate the heat during laser sealing, so as not to cause a sharp change in the temperature of the heating area, thereby ensuring that the glass frit forms a good sintered structure, avoiding the generation of micro-cracks, and improving the life of the screen. The invention also discloses a laser sealing method.

Description

technical field [0001] The invention relates to the field of organic display technology, in particular to a laser sealing heat conduction jig and a laser sealing method for an organic light emitting display device. Background technique [0002] Organic light emitting display devices are generally packaged in Frit. The Frit package adopts the technological process of glass frit printing, pre-baking, and laser sealing. One of the current trends in the development of display screens is that the frame is getting narrower and narrower, the Frit is getting narrower and narrower from the edge of the packaging cover, and the corresponding laser-sealed edge is getting closer and closer to the cutting edge. The glass cover near the laser spot is due to heat storage. A large residual stress is generated, and cutting defects such as edge chipping and corner chipping will occur during cutting. In addition, if the laser power does not match the selected Frit frit (glass frit) during las...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/00H10K50/84H10K71/00
Inventor 李伟丽甘帅燕彭兆基
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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