A kind of epoxy resin material with low thermal expansion at room temperature and preparation method thereof

A technology of epoxy resin and low thermal expansion, which is applied in the field of room temperature low thermal expansion epoxy resin material and its preparation, can solve the problems of poor shear strength, large internal stress, high crosslinking density, etc., and achieve improved thermal conductivity, dielectric The effect of performance improvement

Active Publication Date: 2018-05-18
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the high crosslinking density and three-dimensional network structure of epoxy resin after curing, there are deficiencies such as large internal stress, brittleness, fatigue resistance, heat resistance, and impact resistance, resulting in poor peel strength and shear strength. The shortcomings of low cracking strain make it difficult to meet the requirements of engineering technology, so its application is limited to a certain extent

Method used

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  • A kind of epoxy resin material with low thermal expansion at room temperature and preparation method thereof
  • A kind of epoxy resin material with low thermal expansion at room temperature and preparation method thereof
  • A kind of epoxy resin material with low thermal expansion at room temperature and preparation method thereof

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Embodiment 1

[0029] The present invention also proposes a method for preparing an epoxy resin material with low thermal expansion at room temperature, which includes the following steps: heating the epoxy resin to 90°C, keeping it warm for 10 minutes, adding GaNMn with a particle size of 2.3 μm 3 Stir the micro-nano powder evenly, epoxy resin and GaNMn with a particle size of 2.3 μm 3 The volume ratio of the micro-nano powder is 62:38. Vacuum debubbles for 0.5h. During the process of vacuum debubbling, maintain the temperature at 90°C. Then add 4,4'-diaminodiphenylsulfone, raise the temperature to 120°C, and stir for 2h. Vacuum debubbles for 0.5h, maintain the temperature at 120°C during the process of vacuum debubbling, then solidify, and naturally cool to room temperature to obtain a room temperature low thermal expansion epoxy resin material.

Embodiment 2

[0031] The present invention also proposes a method for preparing an epoxy resin material with low thermal expansion at room temperature, which includes the following steps: heating the epoxy resin to 90°C, keeping it warm for 10 minutes, adding GaNMn with a particle size of 2.3 μm 3 Stir the micro-nano powder evenly, epoxy resin and GaNMn with a particle size of 2.3 μm 3 The volume ratio of the micro-nano powder is 41:59. Vacuum debubbles for 0.5h. During the process of vacuum debubbling, maintain the temperature at 90°C. Then add 4,4'-diaminodiphenylsulfone, raise the temperature to 120°C, and stir for 2h. Vacuum debubbles for 0.5h, maintain the temperature at 120°C during the process of vacuum debubbling, then solidify, and naturally cool to room temperature to obtain a room temperature low thermal expansion epoxy resin material.

Embodiment 3

[0033] The present invention also proposes a method for preparing an epoxy resin material with low thermal expansion at room temperature, which includes the following steps: heating the epoxy resin to 90°C, keeping it warm for 10 minutes, adding GaNMn with a particle size of 2.3 μm3 Stir the micro-nano powder evenly, epoxy resin and GaNMn with a particle size of 2.3 μm 3 The volume ratio of the micro-nano powder is 33:67. Vacuum debubbles for 0.5h. During the process of vacuum debubbling, maintain the temperature at 90°C. Then add 4,4'-diaminodiphenylsulfone, raise the temperature to 120°C, and stir for 2h. Vacuum debubbles for 0.5h, maintain the temperature at 120°C during the process of vacuum debubbling, then solidify, and naturally cool to room temperature to obtain a room temperature low thermal expansion epoxy resin material.

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Abstract

The invention discloses a room temperature low-thermal-expansion epoxy resin material which comprises raw materials of epoxy resin, a GaNMn3 micro nano powder and a curing agent. The invention also discloses a preparation method of the room temperature low-thermal-expansion epoxy resin material. The room temperature low-thermal-expansion epoxy resin material has thermal expansion a low or near-to-zero coefficient at near room temperature, hardness and thermal conductivity are increased significantly, dielectric properties are significantly improved, and the room temperature low-thermal-expansion epoxy resin material has broad application prospects in electronic and electrical appliances, precision optics, coatings, adhesive and other fields.

Description

technical field [0001] The invention relates to the technical field of modified epoxy resin, in particular to an epoxy resin material with low thermal expansion at room temperature and a preparation method thereof. Background technique [0002] Epoxy resin has excellent physical, mechanical and electrical insulation properties, bonding properties with various materials, and the flexibility of its use process, which are not available in other thermosetting plastics, so it can be made into coatings, adhesives, composites, etc. Materials, casting materials, molding materials and injection molding materials, etc., the main end markets include automobiles, electronic and electrical packaging, construction and aerospace industries, and are widely used in various fields of the national economy. [0003] However, due to the high crosslinking density and three-dimensional network structure of epoxy resin after curing, there are deficiencies such as large internal stress, brittleness,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/28C08G59/50
CPCC08G59/504C08K3/28C08L2203/20C08L63/00
Inventor 林建超童鹏郭新格章魁蔺帅戴建明孙玉平
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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