High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph

A technology of alignment and blind holes, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problem of large alignment deviation between graphics and laser blind holes, and achieve the effect of increasing costs

Active Publication Date: 2017-01-18
KINWONG ELECTRONIC TECH (ZHUHAI) CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a high-density interconnection printed circuit board and a method for improving the alignment between blind holes and graphics, aiming at solving the problem of alignment between existing printed circuit board graphics and laser blind holes. big deviation problem

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  • High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph

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Embodiment Construction

[0025] The present invention provides a high-density interconnected printed circuit board and a method for improving the alignment between blind holes and patterns. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] see figure 1 , figure 1 It is a flowchart of a preferred embodiment of a method for improving the alignment between laser blind holes and graphics of the present invention, as shown in the figure, which includes steps:

[0027] S1, material cutting: cut the copper clad laminate to the required size;

[0028] S2. Transfer of inner layer graphics: making inner layer circuit graphics on the copper clad laminate;

[0029] S3, the first pressing: pressing the copper clad laminate, PP, and c...

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Abstract

The invention discloses a high-density interconnection printed circuit board and a method of increasing an aligning degree of a blind hole and a graph. The method comprises the following steps of A, cutting; B, internal layer graph transfer; C, first stitching; D, laser blind hole operating; E, electroless plating copper electroplating; F, second graph transfer; G second stitching; H, X-RAY machine drilling; I, mechanical drilling; J, electroless plating copper electroplating; and K, external layer graph transfer. In the invention, a problem that the graph after the second graph transfer and a laser blind hole generate contraposition deviation can be effectively avoided and simultaneously hole site precision of the laser blind hole is higher than hole site precision of an X-RAY drilling hole. By using a technology in the invention, contraposition precision of the graph and the laser blind hole can be increased to a 2mil range from an original maximum 4mil range; and the technology only needs to be partially changed and cost is not increased.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a high-density interconnected printed circuit board and a method for improving the alignment between blind holes and patterns. Background technique [0002] In the printed circuit board industry, when producing high-density interconnected printed circuit boards, it is difficult to control the alignment between laser blind holes and graphics. In the existing process, X-RAY machines are used after the first lamination Drill out the alignment target hole for graphics transfer. When the graphics and the laser blind hole are aligned, because the target hole and the laser blind hole are not processed by the same equipment, there is a systematic deviation of different equipment, resulting in the alignment between the graphics and the laser blind hole. There is a problem with a maximum deviation of 4mil. [0003] Therefore, the prior art still needs to be improved and developed. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/46H05K3/00
CPCH05K3/0047H05K3/421H05K3/4652H05K2201/09509H05K2203/107H05K2203/166
Inventor 张军谭小林陆玉婷陈前
Owner KINWONG ELECTRONIC TECH (ZHUHAI) CO LTD
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