VCSEL laser tube core packaging method

Abstract

The invention belongs to the technical field of lasers and aims at providing a VCSEL laser tube core packaging method which facilitates packaging and is good in heat dissipation performance. According to the technical scheme, by means of the VCSEL laser tube core packaging method, a tube core comprises a tube body; one end of the tube body is a closed end, and the other end of the tube body is an open end; an ejection opening is formed in the end face of the closed end of the tube body, and a concave lens is arranged in the ejection opening; a laser emission assembly is arranged in the tube body and comprises an installing cover, an outer heat dissipation plate, an inner heat dissipation plate and a VCSEL chip array. The method includes the following steps that a, the laser emission assembly is assembled; b, the laser emission assembly is installed in the tube body; c, a radiator and a dustproof filter net are installed on the tube body; d, the concave lens is installed on the tube body. The heat dissipation efficiency of a VCSEL laser can be greatly improved, and the packaging speed of the VCSEL laser can be greatly increased.

Description

technical field [0001] The invention belongs to the technical field of lasers, and in particular relates to a VCSEL laser tube core packaging method. Background technique [0002] In the field of semiconductor lasers, according to the relationship between the light emitting direction and the plane of the epitaxial wafer where the laser chip is located, lasers can be divided into two types: vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL for short) and edge emitting semiconductor laser (Edge Emitting Laser Diode). . Among them, the emission direction of the vertical cavity surface emitting laser is perpendicular to the direction of the epitaxial wafer, and emits from the top surface of the reaction area, while the emission direction of the edge emitting semiconductor laser is parallel to the direction of the epitaxial wafer, and emits from the edge of the reaction area. Compared with edge-emitting semiconductor lasers, the light emitted ...

AI Technical Summary

Problems solved by technology

On the one hand, due to the single-sided contact between the substrate and the insulating heat conducting sheet, the heat dissipation efficiency is low; on the other hand, due to the difficulty of welding ceramics and metals, in order to ensure the welding of ceramics and metals, it is necessary to mix metal particles in the production of ceramics Forming and sintering will undoubtedly increase the cost, time-consuming and labor-intensive

In addition, due to the unreasonable structure of the existing die, it is difficult to package, the steps are cumbersome, and the yield is low.

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