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Detection method for hardness of micron-size ultrahard grinding materials

A technology of super-hard abrasives and detection methods, applied in the direction of testing material hardness, measuring devices, analyzing materials, etc., can solve the problem that recycled sand and virgin sand cannot be applied at the same time.

Inactive Publication Date: 2017-02-15
镇江荣德新能源科技有限公司
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Problems solved by technology

[0007] The purpose of the present invention is to provide a method for detecting the hardness of micron-sized superabrasives, so as to solve the problem that the existing methods cannot be applied to recycled sand and primary sand at the same time

Method used

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  • Detection method for hardness of micron-size ultrahard grinding materials

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Embodiment

[0038] First, extract the abrasive particle sample to test the roundness value R and the aspect ratio value A of the sample;

[0039] Wherein, aspect ratio (Aspect Ration) A refers to the length L of the width W / particle of particle; Obtain grain type coefficient S=AxR;

[0040] Then, after the destructive test is carried out on the abrasive particle sample, the degree of change in particle size is used to reflect the wear resistance of the abrasive.

[0041] According to the size of the abrasive particles, zirconia balls of different sizes are used and combined in different ways to finally realize the test of the damage degree of the particles within a certain grinding frequency and time range. The method has the advantages of simple operation, less material consumption and strong feasibility.

[0042] For abrasive particles with a D50 of 10 μm, the present invention adopts the combination of small balls as shown in Table 1:

[0043] Table 1 Combination of grinding balls

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Abstract

The invention provides a detection method for the hardness of micron-size ultrahard grinding materials. The detection method comprises the following steps that 1, samples are extracted, a roundness value R and a length-width ratio value A of the samples are detected, and a grain shape coefficient is obtained according to S=A*R; 2, after the grinding grain materials are subjected to a destructive test, grain size distribution of the samples obtained after ball milling is obtained; 3, the grain size distribution, obtained in the step 2, of the samples obtained after ball milling is compared with grain size distribution of the samples before ball milling, and then the grain size decreasing degree of the grinding materials in the process can be obtained; 4, a wear degree coefficient B of the grinding materials is reflected through the grain size decreasing degree of the grinding materials, and the less the grain size is decreased, the lower the coefficient is, and the better the wear resisting capacity is; 5, by combining the grain shape coefficient with the wear degree coefficient, a hardness value (H=S*B) of the modulus can be comprehensively reflected. According to the novel detection method, whether the hardness of the grinding grains is qualified or not and how about the fragility is are mainly represented, and the quality of the materials is analyzed.

Description

technical field [0001] The invention relates to a detection method for identifying the hardness of micron-level abrasives, and is mainly aimed at laboratory analysis of the wear resistance of micron-level abrasive silicon carbide materials. Background technique [0002] Abrasives are sharp, hard materials used to grind the surface of softer materials. The abrasives used are generally divided into two categories: natural abrasives and artificial abrasives. According to the hardness, there are mainly superhard abrasives and ordinary abrasives. Abrasives run the gamut from softer household detergents, gemstone abrasives, to the hardest material, diamond. It can be said that abrasive is an essential material for the manufacture of every precision product. Many natural abrasives have been replaced by artificial abrasives. As a key auxiliary material for solar silicon wafer cutting, silicon carbide plays a key role in the production of silicon wafer cutting. [0003] Silicon ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/40
CPCG01N3/40G01N2203/0284
Inventor 刘瑞鸿孙培亚
Owner 镇江荣德新能源科技有限公司
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