Tin-coating-resistant and welding-resistant material and preparation method thereof
A technology of solder resistance and chemical resistance, which is applied in the field of chemical resistance tin solder resistance materials and its preparation, can solve the problems affecting the service life of printed circuit boards, and achieve the effect of high adhesion
Inactive Publication Date: 2017-02-22
江门市阪桥电子材料有限公司
View PDF6 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The solder mask is a permanent protective film coated on the surface of the printed circuit board, which can prevent short circuits during soldering, so the quality of the solder mask material will affect the service life of the printed circuit board
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～8
[0028] A chemical-resistant tin solder resist material, including the components shown in Table 1 in parts by weight.
[0029] The photosensitive resin 1 used wherein is synthesized by the following steps: 300 parts of solvent, 300 parts of o-cresol epoxy resin, 110 parts of acrylic acid, and 0.1 part of hydroquinone are added to the reaction kettle, heated to 105 ° C, and then the catalyst is added. Amine, reacted for 10 hours, finally added 60 parts of tetrahydrophthalic anhydride, reacted for another 4 hours, and finally obtained photosensitive resin 1 with an acid value of 30 mgKOH / g and a solid content of 61%.
[0030] The photosensitive resin 2 used therein is synthesized by the following steps: 300 parts of solvent, 300 parts of bisphenol A epoxy resin, 110 parts of acrylic acid, and 0.1 part of hydroquinone are added to the reaction kettle, heated to 105 ° C, and then the catalyst is added. Amine, reacted for 10 hours, finally added 50 parts of tetrahydrophthalic anhyd...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| acid value | aaaaa | aaaaa |
| acid value | aaaaa | aaaaa |
| acid value | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a tin-coating-resistant and welding-resistant material and a preparation method thereof. Ink mainly comprises the following components in parts by weight: 20-40 parts of photosensitive resin 1, 20-40 parts of photosensitive resin 2, 2-10 parts of photosensitive monomer, 3-10 parts of epoxy resin, 15-30 parts of filler, 4-10 parts of photoinitiator, 1-8 parts of additive and 2-15 parts of solvent. The preparation method comprises the steps of dispersing raw materials uniformly, then grinding, and filtering to obtain a finished ink product. The tin-coating-resistant and welding-resistant material disclosed by the invention has the advantages of high-temperature resistance, acid-alkaline resistance, heat impact resistance and high adhesive force and the like, and especially has good tin immersion property in the process of tin immersion of a PCB (Printed Circuit Board).
Description
technical field [0001] The invention relates to the field of ink, in particular to a chemical-resistant tin solder resist material and a preparation method thereof. Background technique [0002] Printed circuit board, referred to as PCB (printed circuit board), uses an insulating board as the base material, and completes the point-to-point connection and printing of electronic components according to the pre-design. The use of circuit boards can greatly reduce wiring and assembly errors, thereby improving automation and production efficiency. [0003] The rapid development of the electronics industry has put forward higher requirements for the production of PCB. This high requirement is not only reflected in the complexity of the design, but also puts forward higher requirements for the treatment of the PCB surface. Coating a layer of solder resist material (ink) on the surface of the printed circuit board that does not need to be soldered and on the base material can play ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/107C09D11/03H05K3/28
CPCC09D11/101C09D11/03C09D11/107H05K3/28
Inventor 周中涛
Owner 江门市阪桥电子材料有限公司