An optical interconnection module

Abstract

The invention discloses an optical interconnection module. The module comprises a silicon carrier plate and a base plate; the base plate is provided with flat steps. The top surface of the base plate and the side end face and the top end face of the flat tail step are provided with an electric connecting pad; The silicon carrier plate is vertically arranged on the flat step of the substrate, and the electric connecting pad is arranged on the bottom end face and the outer end face of the silicon carrier plate; The pad on the bottom surface of the silicon carrier plate is corresponding to the position of the pad on the top end surface of the flat surface of the substrate, and is fixedly connected by a welding mode; a laser is connected with the pad at the lower end of the outer side surface of the silicon carrier plate through a routing, and the outer side face of the silicon carrier plate is also connected with the optical fiber through an optical fiber connector. The optical interconnection module can not only realize the requirement that the light emitting direction is changed from vertical to horizontal, but also realize the requirement that the optical fiber is aligned with the light emitting surface of the laser. The optical interconnection module has the advantages of low cost, less process steps, and direct coupling between the optical fiber and the light source, which greatly improves the coupling efficiency and reduces the power consumption of the optical module.

Description

technical field [0001] The invention relates to the technical field of optoelectronic integration, in particular to an optical interconnection module structure. Background technique [0002] In the field of optoelectronic integration technology, most QSFP optical modules with a rate of 100Gbs and below and a length of 2KM or less use VCSEL lasers as light sources. VCSEL lasers are low in cost and small in size, but because the light emitting direction of VCSEL lasers is perpendicular to the upper surface of the chip, Therefore, when the VCSEL laser is coupled with an optical fiber, it is necessary to find a way to turn the optical path by 90°. [0003] At present, in the integration process of QSFP optical modules, there are mainly two ways to turn the optical path by 90°: one is to turn the optical path by making a 45° reflector on the substrate as proposed in patents WO2011117807A1, US20120033979A1, and US8798410B2 ; But this technology needs to make a 45° reflector on th...

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Problems solved by technology

[0004] The technical problem to be solved in the present invention is to provide an optical interconnection module structure with a simple structure and manufacturing process, so as to solve the optical coupling problem between the VCSEL laser and the optical fiber in the integration process of the QSFP optical module, and further improve the production efficiency

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