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Image sensor module and manufacturing method thereof
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A technology of image sensor and manufacturing method, applied in the field of image sensor
Pending Publication Date: 2017-02-22
苏州科阳半导体有限公司
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Abstract
Description
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[0005] In view of this, the present invention proposes an image sensor module and its manufacturing method to solve the problems existing in the existing image sensor module, improve the reliability of the image sensor module, and reduce the difficulty of wiring
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Embodiment 1
[0054] figure 1 It is a schematic structural diagram of the image sensor module provided by Embodiment 1 of the present invention. The image sensor module provided by the embodiments of the present invention can be applied to electronic devices such as smart phones, tablet computers, digital cameras, car driving recorders, and children's toys.
[0055] Such as figure 1 As shown, the image sensor module provided in this embodiment includes:
[0056]The image sensing chip 110 and at least one first auxiliary chip 120, the image sensing chip 110 and at least one first auxiliary chip 120 are packaged into a chip package 100 by the plastic packaging material 101, and the image sensing chip 110 and at least one first auxiliary chip The circuit surfaces of the auxiliary chip 120 face the same direction, wherein the image sensing chip 110 includes an image sensing unit 111, and an encapsulation glass 112 arranged above the light-incident surface of the image sensing unit 111, and th...
Embodiment 2
[0066] figure 2 It is a plan view of a fitting structure provided by Embodiment 2 of the present invention. Such as figure 2 As shown, further, in the image sensor module provided in this embodiment, the interlocking structures 103 are continuously distributed on the edge of the light incident surface of the packaging glass 112 .
[0067] Optionally, a whole groove is formed on the edge of the light-incident surface of the packaging glass 112 by cutting or gas etching to form the fitting structure 103, so that the molding material firmly grasps the packaging glass 112, which improves the reliability of the image sensor module. mechanical reliability.
[0068] image 3 It is a plan view of another interlocking structure provided by Embodiment 2 of the present invention. Optionally, as in image 3 As shown, the fitting structure 103 includes a plurality of fitting units 103 a, so that the fitting structure 103 is intermittently distributed on the edge of the light inciden...
Embodiment 3
[0076] Figure 5 It is a schematic structural diagram of the image sensor module provided by Embodiment 3 of the present invention. Such as Figure 5 As shown, further, the image sensor module provided in this embodiment also includes:
[0077] The second auxiliary chip 150, the second auxiliary chip 150 is attached to the front surface of the chip package 100, wherein the chip package 100 is provided with a through hole 151 penetrating, and a wire 152 is arranged in the through hole 151, the first wire 152 One end is electrically connected to the bonding pad of the second auxiliary chip 150 , and the second end of the wire 152 extends to the back of the chip package 100 .
[0078] The back side of the chip package 100 is formed with a rewiring pattern electrically connected to the bonding pad of the image sensor chip 110, the bonding pad of at least one first auxiliary 120 chip, and the bonding pad of the second end of the wire 152. The rewiring pattern is formed on the rew...
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Abstract
An embodiment of the invention discloses an image sensor module which comprises an image sensingchip and at least one first auxiliary chip. The image sensingchip and at least one first auxiliary chip are packaged by a packaging material for forming a chip package. The circuit surfaces of the image sensing chip and at least one first auxiliary chip are in one same direction, wherein the image sensing chip comprises an image sensing unit and packaging glass which is arranged above a light incident surface of the image sensing unit. The front surface of the chip package is provided with a light passing hole which corresponds with the packaging glass. An engagement structure is formed at a contact part between the light incident surface edge of the packaging glass and the packaging material. The back surface of the chip package is provided with a rewiring pattern which is electrically connected with a pad of the image sensing chip and the pad of at least one first auxiliary chip. The rewiring pattern is provided with a plurality of salient points. The image sensor module further comprises a lens bracket which is mounted on the front surface of the chip package, and furthermore a lens set is fixed on the lens bracket. The image sensor module and the manufacturing method improve reliability of the image sensor module.
Description
technical field [0001] The invention relates to the field of image sensors, in particular to an image sensor module and a manufacturing method thereof. Background technique [0002] An image sensor chip is a semiconductor device that senses external light and converts it into electrical signals. After the image sensor chip is manufactured, first a series of packaging processes are performed on the image sensor chip, and then the mirror mount bracket and the lens are installed to form an image sensor module. Image sensor modules are mainly used in electronic equipment such as mobile phone cameras, digital cameras, car imaging and children's toys. [0003] The existing image sensor chip packaging method is mainly COB (ChipOn Board) packaging, the bare chip is attached to the interconnection substrate with conductive or non-conductive adhesive, and then wire bonding is performed to realize its electrical connection. The image sensor packaging method in the prior art only pac...
Claims
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Application Information
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