High-temperature resistant column crystal

Abstract

The invention discloses a high-temperature resistant column crystal. The high-temperature resistant column crystal comprises a wafer, a glass bead and a lead, wherein the wafer is arranged on the glass bead and fixedly connected with the lead; a metal electrode layer is arranged on the outer end of the wafer, and a film-coated alloy layer is further arranged between the wafer and the metal electrode layer; an electric-conductive adhesive is arranged at the connecting position of the lead and the wafer, an UV curing adhesive is arranged between the wafer and the glass bead, and a high lead tin coating is arranged on the outer end of each of the lead and the glass bead. Through the improvement on the structure of the product disclosed by the invention, the electrical property of the crystal is better, the stability is higher, and the temperature tolerance is obviously improved; and the high-temperature resistant column crystal is further suitable for a reflow soldering production line with high automation degree, and the applicability of the product is wider.

Description

technical field [0001] The invention relates to the field of crystal oscillators, in particular to a high temperature resistant columnar crystal. Background technique [0002] Pillar crystal is a commonly used electronic component, which is widely used in oscillating circuits such as computers, remote controls, and mobile communication equipment. With the improvement of industrial automation and the promotion of surface mount components, the traditional process of adding solder wire with electric soldering iron has been eliminated, replaced by the process of adding solder paste with automatic plug-in, and then soldering and curing through a flow-type reflow oven. . In order to ensure that the solder paste is completely melted and then solidified, the manufacturer must set the temperature of the reflow furnace to about 245 degrees, and the measured temperature can even reach 260 degrees. For the traditional column crystal, because the base and the shell are packaged by cold...

AI Technical Summary

Problems solved by technology

For the traditional column crystal, because the base and the shell are packaged by cold extrusion, in order to ensure the airtightness after packaging, tin is used as the filler, so the whole bracket is tinned, including the kovar ring The welding part with the lead wire is covered with tin layer, but the melting point of pure tin is only more than 220 degrees. When such a product passes through the reflow oven, the tin of the device itself has been melted once, and the airtightness and reliability will be improved. It is affected to varying degrees, and directly affects the electrical properties of the crystal, which greatly affects the performance of the crystal.

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