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Microwave circuit composite substrate with built-in magnetic disk

A technology of microwave circuits and composite substrates, which is applied in circuit devices, printed circuits, printed circuits, etc., can solve the problems of large branch lines, large volume of microwave integrated modules, and increased module volume, so as to reduce the volume and improve the Integration density, the effect of reducing system volume

Pending Publication Date: 2017-02-22
CHENGDU 899 SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because isolators and circulators are indispensable and important components for microwave integrated modules, when designing and manufacturing microwave integrated modules, circulators and isolators can only be installed outside, resulting in increased module volume
In addition, the branch lines of the circulator and the isolator are large, resulting in a large volume of the entire microwave integrated module

Method used

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  • Microwave circuit composite substrate with built-in magnetic disk
  • Microwave circuit composite substrate with built-in magnetic disk

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment one: if figure 1 As shown, a microwave circuit composite substrate with a built-in magnetic sheet includes a composite board and a magnetic sheet 1 built in the composite board, the magnetic sheet 1 is embedded in the PP layer 5, and the composite board is composed of a metal sheet 2, a Dielectric layer 3 and PP layer 5, the PP layer 5 is set between the metal sheet 2 and the dielectric layer 3, the upper and lower surfaces of the dielectric layer 3 are covered with a metal layer 4, the metal sheet 2 It is compounded on the upper surface of the PP layer 5 through the adhesive layer 6 , and the PP layer 5 is compounded on the upper part of the dielectric layer 3 through the adhesive layer 6 .

[0015] The magnetic sheet 1 is any one of gyromagnetic ferrite, permanent ferrite, soft ferrite and rare earth magnet. The dielectric layer 3 is a polytetrafluoroethylene layer. The metal sheet 2 is a copper plate, an aluminum plate or an iron plate. The adhesive lay...

Embodiment 2

[0017] Embodiment two: if figure 2 As shown, the difference between this embodiment and Embodiment 1 is that the composite board is composed of a metal sheet 2, at least two dielectric layers 3 and a PP layer 5, and a The PP layer 5, the upper surface of the dielectric layer 3 on the top is provided with the PP layer 5 and the metal sheet 2 in sequence, and the contact between the dielectric layer 3 and the PP layer 5 is provided with an adhesive layer 6.

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Abstract

The invention discloses a microwave circuit composite substrate with a magnetic disk. The microwave circuit composite substrate comprises a composite plate and the magnetic disk (1) embedded in the composite plate. The composite plate comprises a metal plate (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal plate (2) and the dielectric layer (3), the upper and lower surfaces of the dielectric layer (3) are provided with a metal layer (4), the metal plate (2) is compounded on the upper surface of the PP layer (5) through an adhesive layer (6), and the PP layer (5) is bonded to the upper portion of the dielectric layer (3) via the adhesive layer (6). The microwave circuit composite substrate has the advantages that the substrate volume is greatly reduced, the nonreciprocal transmission device and the reciprocal transmission device can be integrated in the microwave circuit composite substrate to improve the electrical performance and reliability, and produce different types of circulators and isolators.

Description

technical field [0001] The invention relates to the field of radio frequency microwave technology, in particular to a microwave circuit composite substrate with a built-in magnetic sheet. Background technique [0002] At present, the existing microwave substrates, no matter LTCC substrates or PCB substrates, can only integrate reciprocal transmission devices, such as filters, inductors, capacitors, etc. Easy transport devices are integrated inside the substrate. Because isolators and circulators are indispensable and important components for microwave integrated modules, when designing and manufacturing microwave integrated modules, circulators and isolators can only be installed outside, resulting in increased module volume. In addition, the branch lines of the circulator and the isolator are large, resulting in a large volume of the entire microwave integrated module. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcoming...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0233H05K2201/083
Inventor 满吉令郭永强杨继芳段树彬
Owner CHENGDU 899 SCI & TECH