A copper-aluminum composite water-cooled plate and its processing and manufacturing method, and water-cooled heat dissipation method

Abstract

The invention discloses a copper-aluminum compound water-cooling plate and a processing and manufacturing method thereof as well as a water-cooling heat dissipation method. The copper-aluminum compound water-cooling plate comprises a base plate and a cover plate, wherein a cooling liquid flow channel is formed in the base plate; the base plate comprises a copper plate and an aluminum plate laminated together with the copper plate; the copper plate used for mounting a module component is arranged on the front of the base plate; the aluminum plate is arranged on the back of the base plate; the cooling liquid flow channel is formed in the aluminum plate; a jujube-pit-shaped structure is arranged in the cooling liquid flow channel. The copper-aluminum compound water-cooling plate has the characteristics of high welding performance of copper and high heat conductivity and machinability of aluminum, and is compact in structure and light in weight; the flow channel layout manner adopts an arrangement manner of combination of parallel connection and serial connection of the jujube-pit-shaped structure; the disturbance effect of the cooling liquid is greatly improved; the heat exchange area is increased while the pressure loss is also reduced; through the flow channel structure, the heat dissipation efficiency of a water-cooling plate applied to a power module of a high-power converter can be greatly improved; meanwhile, the flow channel structure is low in flow resistance and high in reliability; the requirement on heat dissipation of high-power modules can be met.

Description

technical field [0001] The invention relates to the technical field of heat dissipation. Background technique [0002] With the development of electronic equipment and electronic components in the direction of miniaturization and light weight, the performance requirements and power density requirements of components are further improved, and due to the thermoelectric coupling characteristics of the devices themselves, their losses also increase. Studies have shown that among the common faults of electronic equipment, as high as 50%-60% of the equipment cannot work normally due to the high temperature of the electronic equipment. Therefore, the temperature rise in the electronic equipment must be strictly controlled to ensure the normal and reliable operation of the heating element. , and using a good heat dissipation element, that is, an electronic water-cooled plate, to dissipate heat from these high-power devices is the only way to solve the above problems. [0003] At pr...

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Problems solved by technology

The above existing technologies are difficult to meet the heat dissipation requirements of high-power modules, and the fixed connection method with the heat-dissipated device is single

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