Vacuum electronic tube-sealed low-silver multi-component alloy material and preparation method thereof

Abstract

The invention provides a vacuum electronic tube-sealed low-silver multi-component alloy material and a preparation method thereof. The vacuum electronic tube-sealed low-silver multi-component alloy material comprises the following components by mass percentage: 35-45% of Ag, 45-55% of Cu, 5-8% of Si, 0.6-0.8% of Ni, 0.4-0.6% of B, 0.3-0.5% of Ge, 0.3-0.5% of Nd, 0.2-0.3% of Ce, and 0.2-0.3% of Co. The preparation method comprises the following steps: melting, casting, solid saluting, ageing, turning, cold rolling, tempering, annealing and fine processing. The sealing material has the advantages of high cleanliness, good flowability, corrosion resistance, good antioxidation performance, low sealing temperature, and low cost.

Description

technical field

[0001] The invention relates to the technical field of sealing materials for vacuum electron tubes in the vacuum electronics industry, in particular to a low-silver-content multi-element alloy sealing material. Background technique

[0002] In the vacuum tube sealing industry, due to the high frequency of use of vacuum tubes, it is required that the vacuum tube seal has high airtightness, good mechanical properties of the sealing material, strong corrosion resistance and oxidation resistance. Because of its excellent sealing performance, silver-based sealing materials have occupied a firm position in the use of vacuum tube sealing materials. As the price of silver gradually soared, the cost of sealing materials was greatly increased. Therefore, a low-silver alloy solder with excellent comprehensive properties has become an urgently needed sealing material. Contents of the invention

[0003] In view of the above problems in the prior art, the applicant pro...