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190results about How to "Solid solution strengthening" patented technology

Process for preparing cladding layer on surface of copper base body by utilizing high-speed laser cladding technology

The invention discloses a process for preparing a cladding layer on the surface of a copper base body by utilizing a high-speed laser cladding technology. The process is characterized in that a lasercoaxial powder feeder is used for feeding a cladding alloy material to the surface of the copper base body, meanwhile, layer-by-layer high-speed laser cladding is performed by using an optical fiber laser or an optical fiber coupling semiconductor laser, wherein the process parameters of the laser in the cladding operation process are as follows, the focal length of a focusing lens is 250-300 mm,the cladding power is 2000-8000 W, the diameter of a light spot is 0.3-1.2 mm, the cladding scanning speed is 100-400 mm/s, and the lap joint rate is 65%. According to the preparation process of the obtained cladding layer, by utilizing the laser with the high scanning speed and adopting the specific cladding alloy powder for cooperation, the process parameters of the high-speed laser are determined, on the premise that subsequent other treatment is not needed, the cladding layer with the compact structure, without cracks and air holes and with extremely low dilution rate can be formed the surface of the copper base body, good metallurgical bonding between the cladding layer and the surface of the copper base body can be formed.
Owner:唐山中科量子激光科技有限公司

Ultrafine high-bending resistance alloy powder used for diamond tool and preparation method for ultrafine high-bending resistance alloy powder

The invention discloses ultrafine high-bending resistance alloy powder used for a diamond tool and a preparation method for the ultrafine high-bending resistance alloy powder. The ultrafine high-bending resistance alloy powder comprises the following components in percentage by weight: 5-75% of Cu, 1-15% of Ni, 1-15% of Sn, 1-5% of Si, 1-15% of Al, 1-10% of Cr, 0.1-3% of B, 0.1-3% of V, 0.1-2% of Nb, 0.1-4% of Zr, 0.1-7% of La and the balance of Fe. According to the preparation method, the prepared metal raw materials are subjected to the following steps of operation: (1), smelting; (2), water atomizing; (3), filter pressing and dewatering; (4), vacuum drying; and (5), restoring. According to the invention, the single power particle component uniformity is improved, and meanwhile, extremely high sintering activity is realized. Especially, micro liquid phase sintering is promoted due to the added low-melting point elements, so that higher density is obtained by a diamond tool bit sintering mould, and the holding force on diamond is enhanced. By adding the metal-structure intensifying alloy elements and rare earth elements, the bending resistance is improved to 1900 Mpa, so that the holding force of the mould on the diamond is finally improved, and the diamond tool bit tool with high cutting performance is obtained.
Owner:TIZ ADVANCED ALLOY TECH CO LTD

Nano/superfine medium-manganese TRIP (transformation induced plasticity) steel plate and warm-rolling preparation method thereof

The invention relates to a nano/superfine medium-manganese TRIP (transformation induced plasticity) steel plate and a warm-rolling preparation method thereof, belonging to the technical field of ultrahigh-strength steel. The nano/superfine medium-manganese TRIP steel plate comprises the following chemical components in percentage by weight: 0.17-0.25wt.% of C, 0.00-0.50wt.% of Si, 5.00-7.00wt.% of Mn, 1.00-1.50wt.% of Al, 0.014-0.03wt.% of N, 0.00-0.06wt.% of Nb, 0.00-0.25wt.% of Mo, and the balance of Fe and inevitable impurities. The preparation method comprises the following steps: smelting, forging, carrying out hot rolling, and carrying out warm rolling to obtain the nano/superfine medium-manganese TRIP steel plate; and carrying out heat treatment on the steel plate to obtain the nano/superfine medium-manganese TRIP heat-treated steel plate. By using the warm-rolling technique instead of the typical technique for producing manganese steel, the method provided by the invention has the advantages of simple technique, short production cycle and controllable plate shape. The prepared steel plate has a nano/superfine structure, has the advantages of high strength and favorable properties, and satisfies the target requirements of resource saving, energy consumption reduction, light weight and crash safety enhancement for automobile industry.
Owner:NORTHEASTERN UNIV

High-strength copper-iron-phosphorus alloy and production method thereof

The invention discloses a high-strength copper-iron-phosphorus alloy and a production method thereof. The formula of the copper-iron-phosphorus alloy comprises the following elements in percentage: 2.1-2.6% of Fe, 0.015-0.15% of P, 0.05-0.20% of Zn, Pb of which the percentage is smaller than or equal to 0.03%, 0.01-0.1% of Ni, 0.01-0.1% of Sn, and the balance being Cu. Compared with the prior art, according to the copper-iron-phosphorus alloy disclosed by the invention, trace amounts of Sn elements and Ni elements, which play a solution strengthening role in the alloy, are added in the raw material formula, so that the hardness of the materials under various states can be improved by nearly 5-10%. During the production of the copper-iron-phosphorus alloy disclosed by the invention, the condition of low-temperature annealing is adopted, so that on one hand, atoms of solution strengthening elements Sn and Ni are clustered at the periphery of a dislocation generated after being processed and hardened so as to perform dislocation pinning, and the strength of the alloy is improved; on the other hand, through low-temperature annealing, a short-range ordered structure formed in an organization and the dislocation perform interaction, so that the alloy is hardened.
Owner:安徽鑫科铜业有限公司

Preparing method for superfine and high-bending-strength alloy powder used for diamond tool

The invention discloses a preparing method for superfine and high-bending-strength alloy powder used for a diamond tool. The preparing method includes the steps that metal raw materials are prepared and include, by weight percentage, 5%-85% of Cu, 1%-25% of Ni, 1%-20% of Sn, 0%-8% of Si, 1%-15% of Al, 5%-15% of Cr, 0.1%-5% of B, 0.1%-6% of V, 0.1%-5% of Nb, 0.1%-5% of Zr, 0.1%-10% of La and the balance Fe; and the steps of smelting, water atomization, filter pressing dewatering, vacuum drying and reduction are sequentially conducted, and the superfine and high-bending-strength water atomization alloy powder is prepared. Component uniformity of single-particle powder is improved due to the ultrafine granularity of the superfine alloy powder, and meanwhile extremely-high sintering activity is achieved; especially, the added low-melting-point elements promote sintering of a micro liquid phase, a diamond tool bit sintering matrix has higher density, and the holding force on diamond is improved. Due to the fact that the metal structure strengthening alloy elements and the rare earth elements are added, the bending strength is improved to 1900 MPa, finally, the holding force of the matrix on the diamond is improved, and the diamond tool bit tool high in cutting performance is obtained.
Owner:TIZ ADVANCED ALLOY TECH CO LTD

Micro-nanoparticle reinforced high-indium copper-based active solder and preparation method thereof

The invention relates to a micro-nanoparticle reinforced high-indium copper-based active solder. The active solder comprises the following raw materials of, in parts by weight, 85 - 95 parts of base component, 2.5 - 9 parts of active component, 0.1 - 1 part of micro-component and 2 - 5 parts of micro-nano reinforced particles. A preparation method of the micro-nanoparticle reinforced high-indium copper-based active solder comprises the following steps of weighing and preparing the materials, high-frequency induction melting an intermediate alloy, vacuum smelting a solder, and conventional processing the solder into a filamentous or ribbon-shaped active solder. According to the micro-nanoparticle reinforced high-indium copper-based active solder, the formula is reasonable in design and highin cost performance; the basic component comprises the following components of, in parts by weight, 5 - 15 parts of indium, 3 - 8 parts of tin, 1 - 3 parts of manganese, 1 - 5 parts of phosphorus, 0.5 - 3 parts of antimony, 0.5 - 5 parts of silicon, 0.5 - 5 parts of germanium and the balance copper, through a method of replacing the tin with the indium and the phosphorus compositely, not only isthe melting temperature of the copper-based active solder reduced, but also the plasticity of the solder is improved and the processability of the solder is improved; and by adding the micro-nanoparticles, the strength of the solder and a soldered joint is improved.
Owner:HENAN MECHANICAL & ELECTRICAL VOCATIONAL COLLEGE

Silicon-containing high-entropy alloy coating and preparation method thereof

The invention provides a silicon-containing high-entropy alloy coating and a preparation method thereof, and belongs to the field of alloy coatings. According to the silicon-containing high-entropy alloy coating and the preparation method thereof, a silicon element is used as a secondary element and also is a gap element to be added into CoCrCuFeMn high-entropy alloy so that the quite good high-temperature softening resistance can be achieved through a gap effect of non-metal elements, then the lattice distortion of the high-entropy alloy of the kind can be increased, a solid solution strengthening effect can be achieved, the silicon element and the main element can also form a silicide to be dispersed in the alloy structure, a dispersion strengthening effect is generated, so that the hardness and the wear resistance of the high-entropy alloy of the kind are improved; the self-fluxing element Si is added so that the fluidity of the alloy in the liquid state can be improved, and then the macroscopic morphology of the surface of the coating is improved; and part of the Si can replace Cr with the large atom radius, so that the lattice distortion effect of the alloy is intensified, then the peak value of the FCC phase in the high-entropy alloy structure is changed, through the addition of the Si, the BCC phase can be converted to the FCC phase in the high-entropy alloy, so that thevolume fraction of the FCC phase is promoted to be increased.
Owner:NANCHANG UNIV +1
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