Micro-nanoparticle reinforced high-indium copper-based active solder and preparation method thereof

A technology of micro-nano particles and active brazing filler metal, applied in manufacturing tools, welding equipment, metal processing equipment, etc., to reduce melting temperature, reduce residual stress of brazing, and optimize microstructure
CN110640351AActive Publication Date: 2020-01-03HENAN MECHANICAL & ELECTRICAL VOCATIONAL COLLEGE
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
HENAN MECHANICAL & ELECTRICAL VOCATIONAL COLLEGE
Publication Date
2020-01-03

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Abstract

The invention relates to a micro-nanoparticle reinforced high-indium copper-based active solder. The active solder comprises the following raw materials of, in parts by weight, 85 - 95 parts of base component, 2.5 - 9 parts of active component, 0.1 - 1 part of micro-component and 2 - 5 parts of micro-nano reinforced particles. A preparation method of the micro-nanoparticle reinforced high-indium copper-based active solder comprises the following steps of weighing and preparing the materials, high-frequency induction melting an intermediate alloy, vacuum smelting a solder, and conventional processing the solder into a filamentous or ribbon-shaped active solder. According to the micro-nanoparticle reinforced high-indium copper-based active solder, the formula is reasonable in design and highin cost performance; the basic component comprises the following components of, in parts by weight, 5 - 15 parts of indium, 3 - 8 parts of tin, 1 - 3 parts of manganese, 1 - 5 parts of phosphorus, 0.5 - 3 parts of antimony, 0.5 - 5 parts of silicon, 0.5 - 5 parts of germanium and the balance copper, through a method of replacing the tin with the indium and the phosphorus compositely, not only isthe melting temperature of the copper-based active solder reduced, but also the plasticity of the solder is improved and the processability of the solder is improved; and by adding the micro-nanoparticles, the strength of the solder and a soldered joint is improved.
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Description

technical field

[0001] The invention relates to the technical field of brazing material and its preparation, in particular to a high-indium copper-based active solder reinforced by micro-nano particles and a preparation method thereof. Background technique

[0002] Diamond has extremely high hardness and excellent wear resistance, which determines that it is an ideal abrasive for manufacturing brittle material processing tools, and is widely used in oil drilling, geological exploration, stone processing, architectural decoration and other fields. Due to the small size of the diamond particles, the diamond needs to be made into a single-layer diamond tool or a multi-layer diamond tool before use. The traditional production methods are plating and sintering. However, the covalently bonded diamond and the metal bond have high interfacial energy, which makes it difficult for the metal bond to wet the diamond surface effectively. poor. Therefore, the coated diamond is only mech...

Claims

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