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Micro-nanoparticle reinforced high-indium copper-based active solder and preparation method thereof

A technology of micro-nano particles and active brazing filler metal, applied in manufacturing tools, welding equipment, metal processing equipment, etc., to reduce melting temperature, reduce residual stress of brazing, and optimize microstructure

Active Publication Date: 2020-01-03
HENAN MECHANICAL & ELECTRICAL VOCATIONAL COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of adding particle-reinforced phase is mainly used in silver-based solder, and the application in copper-based solder has not been reported. Therefore, the development of a high-indium copper-based active solder reinforced by micro-nano particles is beneficial to high-performance diamond The preparation of tools is of great significance

Method used

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  • Micro-nanoparticle reinforced high-indium copper-based active solder and preparation method thereof
  • Micro-nanoparticle reinforced high-indium copper-based active solder and preparation method thereof
  • Micro-nanoparticle reinforced high-indium copper-based active solder and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] A high-indium copper-based active solder reinforced by micro-nano particles, the high-indium copper-based active solder reinforced by micro-nano particles includes the following raw materials in parts by weight: 85 parts of basic components, 10 parts of active components, trace amounts 0.2 parts of components and 4.8 parts of micro-nano reinforcing particles; wherein, the basic components include the following components by weight: 15 parts of indium, 4 parts of tin, 1 part of manganese, 2 parts of phosphorus, 0.5 parts of antimony, 0.5 parts of Silicon, 1 part of germanium and the balance of copper; the active component includes the following components in parts by weight: 85 parts of titanium and 15 parts of chromium; the trace component is rare earth cerium; the above components are respectively centered on copper indium Alloy, copper-tin master alloy, copper-manganese master alloy, copper-phosphorus master alloy, copper-antimony master alloy, copper-silicon master al...

Embodiment 2

[0065] The difference between this embodiment and Example 1 is that the raw materials are weighed according to the following parts by weight: 88 parts of basic components, 9 parts of active components, 0.3 parts of trace components and 2.7 parts of micro-nano reinforcing particles; the basic components The element includes 14 parts of indium, 4 parts of tin, 1 part of manganese, 3 parts of phosphorus, 0.8 part of antimony, 0.8 part of silicon, 2 parts of germanium and the balance copper by weight; the active component includes 80 parts of titanium and 20 parts of chromium, its preparation method is identical with embodiment 1.

Embodiment 3

[0067] The difference between this embodiment and Example 1 is that the raw materials are weighed according to the following parts by weight: 90 parts of basic components, 7 parts of active components, 0.5 parts of trace components and 2.5 parts of micro-nano reinforcing particles; the basic components The element includes 12 parts by weight of indium, 5 parts of tin, 1.5 parts of manganese, 3.5 parts of phosphorus, 1 part of antimony, 1 part of silicon, 2 parts of germanium and the balance of copper; the active component includes 75 parts of titanium and 25 parts of chromium, its preparation method is identical with embodiment 1.

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Abstract

The invention relates to a micro-nanoparticle reinforced high-indium copper-based active solder. The active solder comprises the following raw materials of, in parts by weight, 85 - 95 parts of base component, 2.5 - 9 parts of active component, 0.1 - 1 part of micro-component and 2 - 5 parts of micro-nano reinforced particles. A preparation method of the micro-nanoparticle reinforced high-indium copper-based active solder comprises the following steps of weighing and preparing the materials, high-frequency induction melting an intermediate alloy, vacuum smelting a solder, and conventional processing the solder into a filamentous or ribbon-shaped active solder. According to the micro-nanoparticle reinforced high-indium copper-based active solder, the formula is reasonable in design and highin cost performance; the basic component comprises the following components of, in parts by weight, 5 - 15 parts of indium, 3 - 8 parts of tin, 1 - 3 parts of manganese, 1 - 5 parts of phosphorus, 0.5 - 3 parts of antimony, 0.5 - 5 parts of silicon, 0.5 - 5 parts of germanium and the balance copper, through a method of replacing the tin with the indium and the phosphorus compositely, not only isthe melting temperature of the copper-based active solder reduced, but also the plasticity of the solder is improved and the processability of the solder is improved; and by adding the micro-nanoparticles, the strength of the solder and a soldered joint is improved.

Description

technical field [0001] The invention relates to the technical field of brazing material and its preparation, in particular to a high-indium copper-based active solder reinforced by micro-nano particles and a preparation method thereof. Background technique [0002] Diamond has extremely high hardness and excellent wear resistance, which determines that it is an ideal abrasive for manufacturing brittle material processing tools, and is widely used in oil drilling, geological exploration, stone processing, architectural decoration and other fields. Due to the small size of the diamond particles, the diamond needs to be made into a single-layer diamond tool or a multi-layer diamond tool before use. The traditional production methods are plating and sintering. However, the covalently bonded diamond and the metal bond have high interfacial energy, which makes it difficult for the metal bond to wet the diamond surface effectively. poor. Therefore, the coated diamond is only mech...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/0227B23K35/0233B23K35/302B23K35/40
Inventor 杜全斌张黎燕龙伟民王晓侃王星星秦磊陈超张卫伟崔冰徐东
Owner HENAN MECHANICAL & ELECTRICAL VOCATIONAL COLLEGE
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