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82results about How to "Avoid performance changes" patented technology

Electric welding rod for high-manganese austenite low-temperature steel

The invention discloses an electric welding rod for high-manganese austenite low-temperature steel. The electric welding rod is composed of a high-manganese welding core and a coating, wherein the surface of the welding core is coated with the coating. The total weight of the high-manganese welding core is adopted as the reference, and the high-manganese welding core comprises, by weight percentage, 0.20-0.50% of C, 0.15-0.45% of Si, 23.0-30.0% of Mn, 4.0-8.0% of Cr, less than or equal to 0.008% of S, less than or equal to 0.010% of P and the balance Fe and inevitable impurities. The total weight of the coating is adopted as the reference, and the coating comprises, by weight percentage, 45-52% of marble, 25-30% of fluorite, 2-7% of quartz, 3-5% of feldspar, 2-4% of titanium dioxide, 2-7%of rutile, 4-8% of manganese metal, 1-3% of rare earth and silicon iron, 2-5% of ferrotitanium and 1-2% of sodium carbonate. After all power materials are uniformly mixed according to the ratios, sodium-potassium water glass with the weight accounting for 23-29% the weight of the powder materials is added as a binding agent, and the powder materials are pressed onto the welding core; and the weight coefficient of the coating ranges from 0.35% to 0.45%. The electric welding rod meets the requirement for toughness in the environment with the low temperature being minus 196 DEG C so that the problems that existing high-manganese welding rods are poor in structure stability and insufficient in low-temperature toughness can be solved, and the domestic blank is filled up.
Owner:725TH RES INST OF CHINA SHIPBUILDING INDAL CORP

Low-consumption thermal circulation type glass processing kiln furnace

The invention discloses a low-consumption thermal circulation type glass processing kiln furnace. The low-consumption thermal circulation type glass processing kiln furnace comprises a furnace body, wherein a feeding channel and a fuel gas pipe are arranged at upper parts of two sides of the furnace body respectively; a water tank and a working pool, which are parallel to the furnace body, are arranged at the outer side of the furnace body; the water tank and the working pool are located at two sides of the furnace body; a water outlet pipe is arranged at the top of the water tank; and a second heat exchanger is arranged on the water outlet pipe. According to the kiln furnace disclosed by the invention, three heat exchangers are arranged and pipelines are reasonably set and configured, sothat a fuel gas pre-heating function is realized, a combustion speed is improved and the processing time can be shortened; meanwhile, almost current feeding channels adopt metal channels so that performance changes, which are possibly caused by the fact that metal stays at high temperature state for long time, can be effectively avoided by cooling the metal channels, and the service life of the feeding channels is prolonged; surplus heat can be reasonably applied through water circulation and the energy-saving effect is realized; and air in glass liquid can be exhausted through a negative-pressure effect after glass is melted, and the quality of the glass liquid is improved.
Owner:SHANDONG GUANGPU SOLAR ENERGY PROJECT

Gas metal arc welding flux-cored wire used for ultralow-temperature high-manganese steel

The invention relates to a gas metal arc welding flux-cored wire used for ultralow-temperature high-manganese steel. According to the technical scheme, the gas metal arc welding flux-cored wire used for the ultralow-temperature high-manganese steel is composed of 65-70 wt% of a steel strip and 30-35 wt% of flux core powder; the steel strip comprises the following chemical components: 0.10-0.20 wt% of C, 0.01-0.05 wt% of Si, 3-7 wt% of Mn, less than or equal to 0.002 wt% of P, less than or equal to 0.001 wt% of S, and the balance Fe and inevitable impurities; and the flux core powder comprises the following chemical components: 28-34 wt% of rutile, 2-4 wt% of zircon sand, 2-4 wt% of potassium titanate, 20-25 wt% of electrolytic manganese, 8-15 wt% of nickel powder, 8-12 wt% of high-carbon ferro-chrome, and the balance iron powder. According to the gas metal arc welding flux-cored wire used for the ultralow-temperature high-manganese steel, all-position welding can be achieved, and the welding efficiency is high; and formed weld metal is good in forming, low in pore sensitivity and excellent in low-temperature toughness, and the strength matches that of the ultralow-temperature high-manganese steel.
Owner:浙江鸿途焊接科技有限公司 +2

Pneumatic tire

A pneumatic tire that even when having a carcass layer of one-ply structure provided with its upward wound portion extending to an inferior area of belt layer so as to overlap an edge portion of the belt layer, inhibits any deterioration of driveability performance by continuous travel. The pneumatic tire has a carcass layer of one-ply structure, the cord angle of which with respect to the circumferential direction of the tire is in the range of 75 DEG to 90 DEG , provided between a pair of bead portions. At a tread portion, the carcass layer on its outer circumferential side is provided with a belt layer. The carcass layer is wound up around the bead core disposed in each of the bead portions from the tire inside to the outside so that the bead filler disposed on the bead core is pinched by the main body portion and upward wound portion of the carcass layer. The upward wound portion of the carcass layer extends to an inferior area of the belt layer so as to overlap an edge portion of the belt layer. The feature of the pneumatic tire resides in that the height of the bead filler from bead heel is 25 mm or less, and that the sectional area of the bead filler is 65 mm2 or less, and that the rubber composition constituting the bead filler exhibits a value of tan delta at 60 DEG C of 0.20 or less.
Owner:THE YOKOHAMA RUBBER CO LTD

Thin film transferring device and using method thereof

ActiveCN107815662AImprove the efficiency of transfer productionSolve the problem of stress affecting device performanceVacuum evaporation coatingSputtering coatingAdhesiveInternal stress
The invention discloses a thin film transferring device and a using method thereof. The thin film transferring device comprises a box and a vacuum pump; the table top of a first carrying table arranged inside the box and the table top of a second carrying table inside the box are oppositely arranged in the first direction, the table top of the first carrying table is used for bearing a first carrier and an adhesive layer, and the table top of the second carrying table is used for bearing a second carrier and a to-be-transferred thin film; the first carrying table and / or the second carrying table are / is lifted in the first direction; and the vacuum pump is used for providing a vacuum environment for the box. Through a covering and pressing manner, the to-be-transferred thin film is transferred to a to-be-transferred carrier, the vacuum pump is used for providing the vacuum environment for the box, gas in an adhesive is extracted, no air bubbles exist between the transferred thin film and the adhesive, the problem that the device performance is influenced by internal stress of the thin film due to the air bubbles of the adhesive is solved, the product yield is improved; and meanwhile, under the negative pressure environment, the adhesive layer can be in sufficient contact with elements on the two sides, the degree of density is large, the bonding speed is high, and the thin filmtransferring and production efficiency is improved.
Owner:SUZHOU JUZHEN PHOTOELECTRIC

Semiconductor pressure sensor and method of manufacturing the same

InactiveUS20120152029A1Suppressing the variation in the performance of a semiconductor pressure sensorAvoid performance changesFluid pressure measurement by electric/magnetic elementsSemiconductor/solid-state device manufacturingMiniaturizationEngineering
In a method of manufacturing a semiconductor pressure sensor, a multilayer structure including a polysilicon diaphragm, a polysilicon gauge resistor formed on a side of a space which is to serve as a vacuum chamber below the polysilicon diaphragm, and a group of insulating films containing the polysilicon diaphragm and the polysilicon gauge resistor and having an etching solution introduction hole in contact with a sacrificial layer is formed on the sacrificial layer. Then, an etching solution is supplied through the etching solution introduction hole and the sacrificial layer is etched with the etching solution, to thereby obtain a diaphragm body formed of the multilayer structure, which functions on the vacuum chamber, and a surface of a silicon substrate below a first opening of a first insulating film is etched to thereby form the space which is to serve as the vacuum chamber and a diaphragm stopper disposed in the space, protruding toward near the center of the diaphragm body. With this structure, it is possible to provide a technique for suppressing the variation in the performance of a semiconductor pressure sensor when the semiconductor pressure sensor is downsized.
Owner:MITSUBISHI ELECTRIC CORP

Optical module stress release method

The invention relates to the field of optical communication, in particular to a production process of an optical module. An optical module stress release method comprises the following steps: (1) welding an optical device; (2) bending a soft plate; (3) assembling the optical module; (4) performing rapid high-low temperature impact on the optical module; (5) performing normal temperature initial adjustment on the performance of the optical module; (6) electrically aging the optical module; and (7) carrying out a final detection test on the optical module, and comparing parameters such as power,current and reported value of normal temperature initial adjustment to check whether the stress release is complete. With the method, the stress generated when the optical device is welded and the soft plate is bent and the stress generated when the optical device, the soft plate and a PCBA plate are assembled into a tube shell can be effectively released, and the variation of power deviation andperformance caused by the stress of the optical device in the tube shell of the optical module is avoided, so that the stability and reliability of the optical module are guaranteed. The process is simple and convenient, and the method is suitable for the optical modules in various packaging forms.
Owner:DALIAN CANGLONG OPTOELECTRONICS TECH
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