Process for preparing cladding layer on surface of copper base body by utilizing high-speed laser cladding technology

A technology of laser cladding and cladding layer, applied in the direction of metal material coating process, coating, etc., can solve the problems of big difference in performance, large spot reflectivity, unable to form molten pool, etc., and achieve the effect of good metallurgical combination

Active Publication Date: 2019-10-18
唐山中科量子激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the high-speed laser cladding technology on the surface of copper alloy has the following difficulties: ① copper alloy has good thermal conductivity, small specific heat capacity, poor wetting performance, hard oxide film on the surface, and high reflectivity to the spot, which makes the laser The heat generated is not easy to stay on the surface, it is not easy to form a high power density, and the molten pool cannot be formed; ②The performance difference between the material system of the copper alloy substrate and the cladding layer is very large, and the failure problem is serious during the cladding process; ③Insufficient toughness in the cladding layer, there are defects such as thermal cracking and stress

Method used

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  • Process for preparing cladding layer on surface of copper base body by utilizing high-speed laser cladding technology
  • Process for preparing cladding layer on surface of copper base body by utilizing high-speed laser cladding technology
  • Process for preparing cladding layer on surface of copper base body by utilizing high-speed laser cladding technology

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Embodiment 1

[0046] This embodiment relates to the process of preparing a cladding layer on the surface of a copper substrate by using high-speed laser cladding technology.

[0047] A cladding layer prepared on the surface of a copper substrate by using high-speed laser cladding technology, the cladding alloy material includes the following raw material components in mass percentage: Ni: 15% to 20%; Cr: 5% to 10% ;Fe: 15%-28%; C: 6-9%; Co: 9-20%; B: 2-4%; Si: 3.0-5.0%; P: 2%; W: 3%-4%; Wherein, the particle size of the cladding alloy material is 200-800 mesh.

[0048] The raw material formula of alloy material in each embodiment is as shown in the table below:

[0049] Example 1.1 Example 1.2 Example 1.3 Ni 12g 16.44g 20g Cr 5.2g 8g 10g Fe 16.8g 23g 28g C 5.4g 7.4g 9g co 12g 16.5g 19.96g B 2g 3g 4g Si 3g 4g 5g P 1.2g 1.66g 2.04g W 2.4g 3g 4g

[0050] The alloy material of each embodiment in the above t...

Embodiment 2

[0088] This embodiment relates to the detection of the performance of the cladding layer prepared in the first embodiment.

[0089] The cladding alloy materials in the proportions of Examples 1.1-1.3 were prepared under the process of the present invention to obtain samples.

[0090] (1) Detection of phase properties

[0091] A number of samples were randomly selected from the prepared samples, and the image analysis of the high-speed laser cladding layer of each sample was carried out by using the DX-2700X camera diffractometer, and the following results were obtained: Figure 8 Metallographic diagram of cladding layer cross-section shown in (a); Figure 8(a) It can be seen that the upper part is the cladding layer, and the lower part is the mold copper plate, and the cladding layer and the crystallizer copper plate have a clear interface. At the interface, the substrate and the cladding layer are metallurgically bonded. The thickness of the cladding layer is about 0.4mm. T...

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Abstract

The invention discloses a process for preparing a cladding layer on the surface of a copper base body by utilizing a high-speed laser cladding technology. The process is characterized in that a lasercoaxial powder feeder is used for feeding a cladding alloy material to the surface of the copper base body, meanwhile, layer-by-layer high-speed laser cladding is performed by using an optical fiber laser or an optical fiber coupling semiconductor laser, wherein the process parameters of the laser in the cladding operation process are as follows, the focal length of a focusing lens is 250-300 mm,the cladding power is 2000-8000 W, the diameter of a light spot is 0.3-1.2 mm, the cladding scanning speed is 100-400 mm/s, and the lap joint rate is 65%. According to the preparation process of the obtained cladding layer, by utilizing the laser with the high scanning speed and adopting the specific cladding alloy powder for cooperation, the process parameters of the high-speed laser are determined, on the premise that subsequent other treatment is not needed, the cladding layer with the compact structure, without cracks and air holes and with extremely low dilution rate can be formed the surface of the copper base body, good metallurgical bonding between the cladding layer and the surface of the copper base body can be formed.

Description

technical field [0001] The invention relates to the technical field of laser cladding, in particular to a process for preparing a cladding layer on the surface of a copper substrate by utilizing the high-speed laser cladding technology. Background technique [0002] Laser cladding refers to placing the cladding layer material on the surface of the cladding substrate through different feeding methods, and melting it and a thin layer of the substrate surface at the same time through laser irradiation, and forming a metallurgical layer with low dilution degree and forming a metallurgical bond with the substrate after rapid solidification. Combined surface cladding layer, so as to significantly improve the wear resistance, corrosion resistance, heat resistance, oxidation resistance and electrical properties of the base surface, to achieve the purpose of surface modification or repair, not only to meet the specific performance requirements of the material surface, It can also sav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10C22C30/00
CPCC22C30/00C23C24/103
Inventor 王菊花李建平
Owner 唐山中科量子激光科技有限公司
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