Material component high temperature deformation noncontact measurement system and method

A non-contact measurement, high temperature deformation technology, applied in the field of photometric mechanics, can solve problems such as shedding, speckle deformation, and bonding force deterioration, and achieve the effect of improving quality, wide temperature application range, and improving accuracy

Active Publication Date: 2017-03-15
UNIV OF SCI & TECH BEIJING
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Problems solved by technology

The method of spraying inorganic adhesives is to use high-temperature inorganic adhesives to bond high-temperature-resistant particles on the surface of the specimen to form speckles. When the difference is large, the binding force becomes poor, resulting in varying degrees of deformation or even falling off of the speckle.

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  • Material component high temperature deformation noncontact measurement system and method
  • Material component high temperature deformation noncontact measurement system and method
  • Material component high temperature deformation noncontact measurement system and method

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0026] A non-contact measurement method for high temperature deformation of a material component according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0027] Before describing the method of the embodiment of the present invention, a non-contact measurement system 100 for high-temperature deformation of material components is firstly introduced. The system 100 includes a laser 11 , a spatial filter 12 , an industrial CCD camera 13 and an image processor 14 . The ...

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Abstract

The present invention discloses a material component high temperature deformation noncontact measurement system. The system comprises a laser, a spatial filter, an industrial CCD (Charge Coupled Device) camera and an image processor. The laser beam emitted by the laser is illuminated through the spatial filter to the central surface of a test piece in the initial temperature to obtain an initial laser speckle; the CCD camera is configured to obtain a reference image and a deformation image; and the image processor employs the method related to digital images to calculate the deformation displacement field of the reference image relative to the deformation image. According to the embodiment of the invention, the material component high temperature deformation noncontact measurement method effectively improve the precision of the material component high temperature noncontact deformation measurement in the high temperature and is wide in the temperature application range so as to provide a new thinking for the mechanical property of the high-temperature environment measurement material components.

Description

technical field [0001] The invention relates to the technical field of photomechanics, in particular to a non-contact measurement system and method for high-temperature deformation of material components. Background technique [0002] In metallurgy, electric power, aerospace and many other fields, strain measurement technology in high temperature environment is one of the key technologies for evaluating the thermodynamic properties of high temperature material structures. There are two types of strain measurement: "contact" and "non-contact". [0003] The traditional "contact measurement" method based on strain gauges has difficulties in strain element screening, connection, and error compensation when performing high-temperature strain measurement. The measurement method based on high-temperature extensometers has large compression deformation measurement errors and small specimen fixtures. Difficult design, large loss in use under high temperature and other limitations. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/16
CPCG01B11/16
Inventor 阳建宏宋金连刘福佳黎敏孙冬柏孟繁强张建芳张昊阳
Owner UNIV OF SCI & TECH BEIJING
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