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Insulation cooling fin for notebook computer

A notebook computer, heat sink technology, applied in electrical digital data processing, instruments, digital data processing components and other directions, can solve the problems of large size, noise, inconvenience to carry, etc., to achieve small size, thin appearance, reliable heat dissipation effect. Effect

Active Publication Date: 2017-03-15
SUZHOU JIU HONG ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, a plastic cooling plate base with a fan is usually used to quickly dissipate heat from the notebook computer. However, the use of a plastic cooling plate with a fan may not only cause noise during work, but also usually has a large volume, which is inconvenient. carry

Method used

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  • Insulation cooling fin for notebook computer
  • Insulation cooling fin for notebook computer
  • Insulation cooling fin for notebook computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The heat dissipation module and the soaking sheet are integrally formed by copper. The surface roughness of the copper is less than 0.5 μm. Firstly, the copper is washed with alkali to remove oil and pickled to remove residual oxides. Then 50g / L of H 2 SO 4 and 10g / L of hydrogen peroxide in a mixed aqueous solution at a temperature of 0 to 5°C for 5 minutes, followed by water washing. After washing with water, carry out oxidation treatment under the condition that the temperature of the oxidation treatment solution is 20°C, the treatment time is 1 minute, the composition of the oxidation treatment solution is 100g / L hydrogen peroxide, 12.0g / L 3-aminopropyltrimethoxy Silane, 20g / L of citric acid, 20g / L of aminonaphthalene disulfonic acid, and the balance of water. After oxidation treatment, after washing with water, a fine concave-convex structure can be observed under the SEM field of view, and the heat dissipation module and soaking sheet after treatment are reddish ...

Embodiment 2

[0023] The heat dissipation module and the soaking sheet are integrally formed by copper. The surface roughness of the copper is less than 0.5 μm. Firstly, the copper is washed with alkali to remove oil and pickled to remove residual oxides. Then 50g / L of H 2 SO 4 and 10g / L of hydrogen peroxide in a mixed aqueous solution at a temperature of 0 to 5°C for 5 minutes, followed by water washing. After washing with water, carry out oxidation treatment under the condition that the temperature of the oxidation treatment solution is 20°C, the treatment time is 5 minutes, the composition of the oxidation treatment solution is 50g / L hydrogen peroxide, 8.0g / L 3-aminopropyl trimethoxy Silane, 20g / L of citric acid, 10g / L of β-aminoethanesulfonic acid, and the balance of water. After oxidation treatment, after washing with water, a fine concave-convex structure can be observed under the SEM field of view, and the heat dissipation module and soaking sheet after treatment are reddish brown....

Embodiment 3

[0025] The heat dissipation module and the soaking sheet are integrally formed by copper. The surface roughness of the copper is less than 0.5 μm. Firstly, the copper is washed with alkali to remove oil and pickled to remove residual oxides. Then 50g / L of H 2 SO 4 and 10g / L of hydrogen peroxide in a mixed aqueous solution at a temperature of 0 to 5°C for 5 minutes, followed by water washing. After washing with water, under the condition that the oxidation treatment solution temperature is 25 ℃, carry out oxidation treatment, treatment time is 3 minutes, and the composition of oxidation treatment solution is the hydrogen peroxide of 80g / L, the N-2-(aminoethyl group of 10.0g / L )-3-aminopropylmethyldiethoxysilane, the citric acid of 25g / L, the β-taurine of 18g / L, and the water of remainder. After oxidation treatment, after washing with water, a fine concave-convex structure can be observed under the SEM field of view, and the heat dissipation module and soaking sheet after trea...

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Abstract

The invention relates to an insulation cooling fin for a notebook computer, and belongs to the technical field of accessory parts for notebook computers. The insulation cooling fin includes a cooling fin main body made of synthetic resin, and the cooling fin main body includes a first main surface used for being in contact with the notebook computer and a second main surface which is in partial contact with a supported object; a cooling module made of metals is arranged on the first main surface, and the cooling module extends from the first main surface to the inner portion of the cooling fin main body. The inner portion of the cooling fin main body is provided with a soaking sheet made of metals, the soaking sheet is approximately parallel to the first main surface, and the soaking sheet is in contact with the cooling module. The insulation cooling fin for the notebook computer is stable and reliable in cooling effect, no fan is required, the cooling fin is light and thin, small in size and convenient to carry in a travel.

Description

technical field [0001] The invention relates to the technical field of accessories for notebook computers, and more specifically, the invention relates to an insulating heat sink for notebook computers. Background technique [0002] With the popularity of notebook computers, the trend is that the function of the CPU is becoming more and more powerful, but the development trend of its appearance and size is becoming thinner and lighter; and as the calculation speed of electronic components such as the CPU in it is getting faster and faster, As the circuit density increases, the heat generated by the components of the notebook computer continues to increase, and as the size becomes smaller and smaller, higher and higher requirements are placed on heat dissipation. In the prior art, a plastic cooling plate base with a fan is usually used to quickly dissipate heat from the notebook computer. However, the use of a plastic cooling plate with a fan may not only cause noise during w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/203
Inventor 卢强
Owner SUZHOU JIU HONG ELECTRON
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