Reduced pressure drying device and reduced pressure drying method

Abstract

The invention provides a reduced pressure drying device and reduced pressure drying method. The reduced pressure drying device receives a substrate in the inner space in a chamber, and exhausts ambient gas of the inner space through an exhausting pipe connected with the chamber to reduce the pressure of the inner space and heat the inner space. In this way, the solvent content contained in a coating film of the substrate can be gasified and the coating film is dried. The reduced pressure drying device comprises an auxiliary pipe heating portion which heats an auxiliary pipe. The reduced pressure drying device can stably reduce pressure and heat simultaneously.

Description

technical field [0001] The present invention relates to a glass substrate for a liquid crystal display device, a semiconductor wafer, a glass substrate for a plasma display panel (PDP), a glass substrate for a photomask, a substrate for a color filter, and a substrate for a recording disk. , A reduced-pressure drying device and a reduced-pressure drying method for drying coating films on substrates for precision electronic devices such as substrates for solar cells and substrates for electronic paper (hereinafter referred to as "substrates"). Background technique [0002] Conventionally, in the manufacturing process of the above-mentioned precision electronic device substrate, in order to dry the coating film formed on the surface of the substrate, the solvent component contained in the coating film is vaporized and dried using a reduced-pressure treatment. vacuum drying technology. However, as the coating film becomes thicker, the time required for drying under reduced pre...

AI Technical Summary

Problems solved by technology

However, as the coating film becomes thicker, the time required for drying under reduced pressure increases, and more efficient drying under reduced pressure is desired.

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