Earphone wire forming method

Abstract

The invention is suitable for the technical field of an earphone. The invention discloses an earphone wire forming method which comprises a wire shaping step on a cut wire which comprises a wire middle layer that wraps an enameled stranded wire and a wire outer layer that wraps the wire middle layer. The wire shaping step comprises processes of performing pre-shaping on the wire with an appropriate length so that the wire is preset to a required shape; and performing heating forming, namely performing heating forming on the pre-shaped wire. Because pre-shaping is performed on the wire and the pre-shaped wire is placed into boiled water or a baking furnace for performing baking for further shaping, a controllable heating temperature is realized. Not only can secondary injection molding forming in a high-temperature high-pressure mold be saved for preventing production process increase, but also core wire damage or core wire contact caused by the high temperature and high pressure in secondary injection molding forming can be prevented. Furthermore the earphone wire forming method has advantages of improving quality of an earphone wire, reducing process difficulty, and improving product yield rate and production efficiency.

Description

technical field [0001] The invention relates to the technical field of manufacturing earphone products, in particular to a method for forming earphone wires. Background technique [0002] When the existing earphone wire is made, the first step is to draw the copper wire, that is, to make the copper rod pass through the mold (roller) under the action of external force to obtain the copper wire of the required size, such as a diameter of The second step is copper wire annealing, that is, when the copper wire is heated to a certain temperature, the toughness of the copper wire is improved and the strength of the copper wire is reduced by recrystallization; the third step is the conductor stranding, using 14 The copper wires are stranded in a bundle to meet the electrical performance requirements; the fourth step is to dip and coat the insulating varnish to complete the enamelled stranded wire; the fifth step is to extrude and coat the silicone wire, and use a silicone extrude...

AI Technical Summary

Problems solved by technology

[0003] The earphone wire made by the above process has the following disadvantages. First, multiple injection molding is required, and its manufacturing process is complicated.

Second, silicone injection molding needs to be carried out under high temperature and high pressure conditions, which is easy to melt the insulating paint layer and cause contact between core wires, resulting in electrical signal interference

3. A single enameled wire cannot be coated with thin silica gel, but all the wire cores can only be coated after forming a bundle (because the silica gel needs to be formed at high temperature, the enameled

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