Substrate heating device
A technology for heating devices and substrates, applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of heat loss and reduction in the guide part, and the decrease in temperature uniformity in the heating process, so as to improve the yield and ensure uniform temperature sexual effect
Active Publication Date: 2017-03-22
SEMES CO LTD
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Problems solved by technology
[0004] However, heat loss frequently occurs through the guide portion during the heating process of the substrate with the current substrate heating apparatus.
That is, during heating of the substrate, the heat supplied by the heating plate to the substrate is lost through the guide portion of the through-hole structure.
Therefore, when the substrate is heated by the current substrate heating apparatus, the temperature around the guide portion of the through-hole structure is relatively lowered, so the temperature uniformity of the heating process is lowered, and the heating cannot be performed properly and stably. process
Especially, when the area of the substrate is relatively large, a plurality of guides provided with a plurality of ejector pins are arranged not only in the peripheral portion of the heating plate, but also in the central portion of the heating plate, so that the Severe heat loss occurs due to the guide part during the heating process of the substrate
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[0015] A substrate heating apparatus according to an embodiment of the present invention will be described below. The present invention can be modified in many ways, and can have various forms, and the embodiments are described in detail below. However, the intention is not to limit the present invention to the specific disclosed form, and therefore, it should be understood that all changes, equivalents, and substitutions belonging to the spirit and technical scope of the present invention are included. In describing each drawing, similar reference numerals are assigned to similar constituent elements. The terms first, second, etc. may be used to describe various constituent elements, but the constituent elements are not limited by the terms. The purpose of using the terms is to distinguish one constituent element from other constituent elements. The terminology used in this application is only used to describe a specific embodiment, and the purpose is not to limit the prese...
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The invention discloses a substrate heating device. The substrate heating device comprises a heating plate, which is used to heat a substrate; a guiding part, which is provided with a through hole structure penetrating the heating plate; a top rod, which is used to support the substrate to be conveyed to the heating plate by lifting the guiding part; a heat energy loss prevention part, which is used to prevent the loss of the heat energy transferred from the heating plate to the substrate. The heating plate is used to encircle the guiding part. The substrate heating device is used to guarantee the uniformity of the temperature during the heating of the substrate by preventing the heat energy loss.
Description
technical field [0001] The invention relates to a substrate heating device, in particular to a substrate heating device with a push rod. Background technique [0002] During the manufacture of integrated circuit components such as semiconductor components and flat panel display components, the heating process of the substrate is very frequent. For example, after coating the photoresist solution on the substrate, a process of heating the substrate may be performed in order to remove the solvent remaining in the photoresist solution. [0003] A current substrate heating device for heating a substrate generally includes a heating plate on which a substrate is placed, a lift for receiving the substrate delivered by a robot arm and placing the substrate on the heating plate. pin). The ejector rod is generally capable of ascending and descending within a guide portion having a through-hole structure penetrating the heating plate. [0004] However, heat loss frequently occurs th...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67098
Inventor 金基哲
Owner SEMES CO LTD