Polishing film

Abstract

The purpose of the present invention is to provide a polishing film which has high grinding power and is not susceptible to causing a defect in an end face of an optical fiber connector due to change in the loading conditions during polishing. The present invention is a polishing film which comprises a base film and a polishing layer that is laminated on the front surface of the base film. This polishing film is characterized in that: the polishing layer contains polishing particles and a binder therefor; and the amount of wear of the polishing layer in a Taber abrasion test is from 10 mg to 25 mg (inclusive). The content of the polishing particles in the polishing layer is preferably 85% by mass or more. It is preferable that the polishing particles contain first polishing particles having a primary particle diameter of 10 nm or more but less than 50 nm and second polishing particles having a primary particle diameter of 50 nm or more but less than 250 nm. The average thickness of the polishing layer is preferably from 4 [mu]m to 15 [mu]m (inclusive). It is preferable that the polishing particles are silica particles.

Description

technical field

[0001] The invention relates to a grinding film. Background technique

[0002] When connecting optical fibers to each other in an optical fiber communication network, easily detachable optical connectors are widely used. This connection is performed by directly inserting ferrules for optical fiber alignment. Therefore, in order to reduce the optical loss (communication loss) of the connected optical fiber, it is required that the connection end face of the connected optical fiber connector is a sufficiently smooth surface and that no gap is generated between the optical fibers on the connection end face (not pulled into the ferrule). optical fiber).

[0003] The grinding of the connection end face of this optical fiber connector is carried out through the four processes of adhesive removal process, rough spherical surface grinding process, intermediate finishing process and finishing grinding process, wherein the grinding accuracy of the finishing grinding ...

Examples

Embodiment approach

[0062] The present invention is not limited to the above-described embodiments, and can be implemented in embodiments to which various changes and improvements have been added other than the above-described embodiments.

[0063] In the above-mentioned embodiment, the polishing film in which the polishing layer is directly formed on the surface of the base film has been described, but it is also possible to install between the base film and the polishing layer to ensure the close contact between the base film and the polishing layer. permanent primer treatment. The main component of the primer treatment layer is not particularly limited as long as the adhesion between the base film and the abrasive layer can be ensured. For example, water-soluble or water-dispersible polyester or acrylic resin or unsaturated bond-containing A resin obtained by grafting a compound on a water-soluble or water-dispersible polyester containing a hydrophilic group.

[0064] The primer-treated layer c...

Embodiment 1

[0069] 100 parts by mass of organosilica sol (Nissan Chemical Industry Co., Ltd. "MEK-ST", primary particle diameter of 10 nm to 20 nm, solid content of 30 mass %) as the first abrasive particles, 50 parts by mass of Organosilica sol ("PL-7L-IPA" of Fuso Chemical Industry Co., Ltd., the average primary particle diameter is 75 nm, and the solid content is 20% by mass) as the second abrasive particles, 13 parts by mass of Organosilica sol (Nissan Chemical Industry Co., Ltd. "MEK-ST-2040", average primary particle diameter of 200 nm, solid content of 40% by mass), 27 parts by mass of organic silica sol containing 5% by mass of N,N-dimethylformamide solution of acrylonitrile-butadiene rubber ("N230S" of JSR Co., Ltd.) as a binder, 27 parts by mass containing 5% by mass of Binder cellulose resin ("Ethocel (ethyl cellulose) 100" of Nissei Co., Ltd.) methyl ethyl ketone solution and 3 parts by mass of polyisocyanate (Sumika Bayer) as a binder Polyurethane ("Desmodule L75C" of Sumika...

Embodiment 2

[0072] 100 parts by mass of organosilica sol ("MEK-ST" of Nissan Chemical Industry Co., Ltd., primary particle diameter of 10 nm to 20 nm, solid content of 30 mass %) as the first abrasive particles, 39 parts by mass of As the second abrasive particles, organic silica sol ("PL-7L-IPA" of Fuso Chemical Industry Co., Ltd., the average primary particle diameter is 75nm, and the solid content is 20% by mass), 19 parts by mass of Organosilica sol (Nissan Chemical Industry Co., Ltd. "MEK-ST-2040", average primary particle diameter of 200 nm, solid content of 40% by mass), 30 parts by mass of organosilica sol containing 5% by mass of the second abrasive particle N,N-dimethylformamide solution of acrylonitrile-butadiene rubber ("N230S" of JSR Co., Ltd.) as a binder, 30 parts by mass containing 5% by mass of The cellulose resin of the binder ("Ethocel (ethyl cellulose) 100" of Nissei Co., Ltd.) dissolved in methyl ethyl ketone and 4 parts by mass of polyisocyanate (Sumika Bayer Polyur...

technical field

[0001] The invention relates to a grinding film. Background technique

[0002] When connecting optical fibers to each other in an optical fiber communication network, easily detachable optical connectors are widely used. This connection is performed by directly inserting ferrules for optical fiber alignment. Therefore, in order to reduce the optical loss (communication loss) of the connected optical fiber, it is required that the connection end face of the connected optical fiber connector is a sufficiently smooth surface and that no gap is generated between the optical fibers on the connection end face (not pulled into the ferrule). optical fiber).

[0003] The grinding of the connection end face of this optical fiber connector is carried out through the four processes of adhesive removal process, rough spherical surface grinding process, intermediate finishing process and finishing grinding process, wherein the grinding accuracy of the finishing grinding ...

Examples

Embodiment approach

[0062] The present invention is not limited to the above-described embodiments, and can be implemented in embodiments to which various changes and improvements have been added other than the above-described embodiments.

[0063] In the above-mentioned embodiment, the polishing film in which the polishing layer is directly formed on the surface of the base film has been described, but it is also possible to install between the base film and the polishing layer to ensure the close contact between the base film and the polishing layer. permanent primer treatment. The main component of the primer treatment layer is not particularly limited as long as the adhesion between the base film and the abrasive layer can be ensured. For example, water-soluble or water-dispersible polyester or acrylic resin or unsaturated bond-containing A resin obtained by grafting a compound on a water-soluble or water-dispersible polyester containing a hydrophilic group.

[0064] The primer-treated layer c...

Embodiment 1

[0069] 100 parts by mass of organosilica sol (Nissan Chemical Industry Co., Ltd. "MEK-ST", primary particle diameter of 10 nm to 20 nm, solid content of 30 mass %) as the first abrasive particles, 50 parts by mass of Organosilica sol ("PL-7L-IPA" of Fuso Chemical Industry Co., Ltd., the average primary particle diameter is 75 nm, and the solid content is 20% by mass) as the second abrasive particles, 13 parts by mass of Organosilica sol (Nissan Chemical Industry Co., Ltd. "MEK-ST-2040", average primary particle diameter of 200 nm, solid content of 40% by mass), 27 parts by mass of organic silica sol containing 5% by mass of N,N-dimethylformamide solution of acrylonitrile-butadiene rubber ("N230S" of JSR Co., Ltd.) as a binder, 27 parts by mass containing 5% by mass of Binder cellulose resin ("Ethocel (ethyl cellulose) 100" of Nissei Co., Ltd.) methyl ethyl ketone solution and 3 parts by mass of polyisocyanate (Sumika Bayer) as a binder Polyurethane ("Desmodule L75C" of Sumika...

Embodiment 2

[0072] 100 parts by mass of organosilica sol ("MEK-ST" of Nissan Chemical Industry Co., Ltd., primary particle diameter of 10 nm to 20 nm, solid content of 30 mass %) as the first abrasive particles, 39 parts by mass of As the second abrasive particles, organic silica sol ("PL-7L-IPA" of Fuso Chemical Industry Co., Ltd., the average primary particle diameter is 75nm, and the solid content is 20% by mass), 19 parts by mass of Organosilica sol (Nissan Chemical Industry Co., Ltd. "MEK-ST-2040", average primary particle diameter of 200 nm, solid content of 40% by mass), 30 parts by mass of organosilica sol containing 5% by mass of the second abrasive particle N,N-dimethylformamide solution of acrylonitrile-butadiene rubber ("N230S" of JSR Co., Ltd.) as a binder, 30 parts by mass containing 5% by mass of The cellulose resin of the binder ("Ethocel (ethyl cellulose) 100" of Nissei Co., Ltd.) dissolved in methyl ethyl ketone and 4 parts by mass of polyisocyanate (Sumika Bayer Polyur...

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