A kind of multi-phase high dielectric constant composite material with isolation structure and its preparation method

A technology of high dielectric constant and composite materials, which is applied in the field of dielectric materials, can solve the problems of restricting practical applications, a large number of composite materials, and the reduction of mechanical properties, and achieve the effects of improving the interface, inhibiting agglomeration, and increasing the dielectric constant

Active Publication Date: 2019-01-08
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Usually when the filling amount of ceramic particles is about 60vol.%, the composite material can obtain a higher dielectric constant, and such a high filling amount will cause a large number of pores and defects in the composite material, and the mechanical properties will be reduced, which limits their use in Practical Applications in Dielectric Materials for Embedded Capacitors
Patent CN201210145040.6 discloses a three-phase composite material containing modified graphene with high dielectric constant and its preparation method. The composite material is prepared from polyvinylidene fluoride, barium titanate particles and polyaniline modified graphene particles , but the highest dielectric constant of the composite material is also less than 200, and the preparation method takes a long time to prepare

Method used

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  • A kind of multi-phase high dielectric constant composite material with isolation structure and its preparation method
  • A kind of multi-phase high dielectric constant composite material with isolation structure and its preparation method
  • A kind of multi-phase high dielectric constant composite material with isolation structure and its preparation method

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Effect test

Embodiment 1

[0031] A method for preparing a high dielectric constant multi-component polymer-based composite material with an isolation structure, comprising the steps of:

[0032] (1) Dissolving 15 parts by mass of polyphenylene ether in 135 parts by mass of methylene chloride to obtain a polyphenylene ether solution;

[0033] (2) Then 1.5 parts by mass of PVP and 1.5 parts by mass of carbon black are uniformly mixed, and then mixed uniformly with the polyphenylene ether solution of step (1); finally, mixed uniformly with 5 parts by mass of glass beads to obtain a uniform mixture;

[0034] (3) The homogeneous mixture obtained in step (2) is further mixed with 100 parts by mass of epoxy resin, and finally the solvent is removed to obtain a further homogeneous mixture;

[0035] (4) Mix 100 parts by mass of diaminodiphenylsulfone DDS and 0.3 parts by mass of N,N-dimethylbenzylamine evenly, and add 85 parts by mass of this curing agent mixture to the mixture in step (3) Continue to mix well...

Embodiment 2

[0038] A method for preparing a high dielectric constant multi-component polymer-based composite material with an isolation structure, comprising the steps of:

[0039] (1) Dissolving 25 parts by mass of polyetherimide in 225 parts by mass of methylene chloride to obtain a polyetherimide solution;

[0040] (2) Then mix 1 mass part of PVP and 1 mass part of graphene uniformly, then mix uniformly with the polyetherimide solution of step (1); finally mix uniformly with 7.5 mass parts of glass microspheres to obtain a uniform mixture;

[0041] (3) The homogeneous mixture obtained in step (2) is further mixed with 100 parts by mass of epoxy resin, and finally the solvent is removed to obtain a further homogeneous mixture;

[0042] (4) Mix 100 parts by mass of methyltetrahydrophthalic anhydride and 0.3 parts by mass of N,N-dimethylbenzylamine, and add 85 parts by mass of the curing agent mixture to step (3) Continue to mix well in the mixture;

[0043](5) The homogeneous mixture ...

Embodiment 3

[0045] A method for preparing a high dielectric constant multi-component polymer-based composite material with an isolation structure, comprising the steps of:

[0046] (1) Dissolving 40 parts by mass of polystyrene in 360 parts by mass of chloroform to obtain a polystyrene solution;

[0047] (2) Then 1.5 parts by mass of PVP and 1.5 parts by mass of carbon nanotubes are mixed evenly, and then mixed with the polystyrene solution of step (1); finally mixed with 10 parts by mass of glass beads to obtain a homogeneous mixture ;

[0048] (3) The homogeneous mixture obtained in step (2) is further mixed with 100 parts by mass of epoxy resin, and finally the solvent is removed to obtain a further homogeneous mixture;

[0049] (4) Mix 100 parts by mass of methylhexahydrophthalic anhydride and 0.3 parts by mass of N,N-dimethylbenzylamine, and add 85 parts by mass of the curing agent mixture to the step (2) Continue to mix well in the mixture;

[0050] (5) The homogeneous mixture ob...

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Abstract

The invention discloses a multi-phase high-dielectric-constant composite material with an isolation structure and a preparation method thereof. The material is prepared from, by mass, 0-10 parts of conducting packing, 10-50 parts of thermoplastic resin, 0-1 parts of an accelerant, 0-20 parts of a modifying agent, 0-20 parts of isolation balls, 50-100 parts of a curing agent and 100 parts of epoxy resin. By virtue of a suitable solvent and by means of a solution blending method, the modifying agent, the conducting packing, the thermoplastic resin and the epoxy resin are mixed to be uniform, the curing agent is added, the materials are mixed to be uniform, the mixture is poured into a mold and smeared into an electrode plate, heating is conducted for curing, and then the high-dielectric-constant multipolymer-based composite material with the isolation structure can be obtained. The block-shaped and film-shaped composite material can achieve the high dielectric constant and the low dielectric loss when the content of the conducting packing is low, is simple in preparation technology, easy to mold and process and short in molding period and has a very wide application prospect in the micro-electronics field and the motor and cable industries.

Description

technical field [0001] The invention belongs to the field of dielectric materials, and in particular relates to a multiphase high dielectric constant composite material with an isolation structure and a preparation method thereof. Background technique [0002] Polymer-based composite materials with high dielectric constant have very good performance in storing electric energy and uniform electric field, plus good mechanical properties and low cost, so they have very broad application prospects in the field of microelectronics, motor and cable industries . [0003] At present, there are two main ways to improve the dielectric constant of composite materials: one is to add ceramic fillers to the polymer matrix; the other is to compound the polymer matrix with conductive fillers, and use conductive particles to percolate in the insulating matrix. The percolation effect at the transition to increase the dielectric constant of the polymer matrix. Usually when the filling amount...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L71/12C08L39/06C08L79/08C08L25/06C08L61/16C08K13/04C08K7/20C08K3/04C08K7/24
CPCC08K2201/001C08K2201/003C08K2201/011C08L63/00C08L2203/20C08L2205/03C08L71/12C08L39/06C08K13/04C08K7/20C08K3/04C08L79/08C08L25/06C08K7/24C08L61/16
Inventor 马传国万华妹戴培邦李玉婷欧气局
Owner GUILIN UNIV OF ELECTRONIC TECH
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